LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE

• US 20110198660A1
• Filed: 02/18/2011
• Published: 08/18/2011
• Est. Priority Date: 02/18/2010
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Park, Duk Hyun, Bae, Jung Hyeok, Jeong, Young Kyu, Park, Kyung Wook
• Granted Patent: US 8,723,213 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

Provided is a light emitting device. In one embodiment, a light emitting device including: a support member; a light emitting structure on the support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member at a peripheral region of an upper surface of the support member; an electrode including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode.

Claims

1. A light emitting device comprising:

a support member;

a light emitting structure on the support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer;

a protective member at a peripheral region of an upper surface of the support member;

an electrode comprising an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and

an insulation layer between the side surface of the light emitting structure and the electrode.

2. The light emitting device of claim 1, further comprising a bonding metal layer on at least a part of the extended portion.

3. The light emitting device of claim 1, wherein the side surface of the light emitting structure is inclined.

4. The light emitting device of claim 1, wherein the insulation layer comprises at least one selected from the group consisting of Si0₂, Si_xO_y, Si₃N₄, Si_xN_y, SiO_xN_y, Al₂O₃, and TiO₂.

5. The light emitting device of claim 1, wherein the support member comprises an electrically conductive material.

6. The light emitting device of claim 1, wherein the electrode comprises a metal having an electrical conductivity and forming an ohmic contact with the first conductive type semiconductor layer.

7. The light emitting device of claim 1, wherein the upper portion comprises a pattern.

8. The light emitting device of claim 7, wherein the upper portion has an opening.

9. The light emitting device of claim 7, further comprising a bonding metal layer on at least a part of the extended portion,

wherein the upper portion and the bonding metal layer is connected to the bonding metal layer by a line portion.

10. The light emitting device of claim 9, wherein the bonding metal layer and the line portion are integrally formed.

11. The light emitting device of claim 9, wherein the bonding metal layer has a width the same as or larger than that of the line portion.

12. The light emitting device of claim 1, wherein the electrode is formed on an entire region of the light emitting structure and the protective member.

13. The light emitting device of claim 12, wherein the electrode comprises at least one selected from the group consisting of a metal and a transparent conductive material.

14. A light emitting device package comprising:

a light emitting device comprising;

a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer;

a protective member at a peripheral region of an upper surface of the support member;

an electrode comprising an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and

an insulation layer between the side surface of the light emitting structure and the electrode,

a package body where the light emitting device is disposed;

a lead electrode on the package body, the lead electrode electrically connected to the light emitting device; and

a socket electrically connected to the electrode of the light emitting device and the lead electrode.

15. The light emitting device package of claim 14, wherein the light emitting device further comprises a conductive support member under the light emitting structure, and

wherein the light emitting device package further comprises a through electrode electrically penetrating the package body to be connected to the conductive support member.

16. The light emitting device package of claim 14, wherein the socket comprises an opening for inserting the light emitting structure.

17. The light emitting device package of claim 15, wherein the socket comprises a socket electrode electrically connected to the extended portion of the light emitting device, and an insulating body insulating the socket electrode and the conductive support member.

18. The light emitting device package of claim 17, further comprising a bonding metal layer on at least a part of the extended portion.

19. The light emitting device package of claim 18, wherein the socket electrode comprises a concave portion having a shape corresponding to the bonding metal layer.

20. The light emitting device package of claim 14, wherein the socket surrounds the side portion.