Circuit Board

• US 20110198919A1
• Filed: 02/16/2011
• Published: 08/18/2011
• Est. Priority Date: 02/17/2010
• Status: Abandoned Application

• Current Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Original Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Inventors: HATTORI, Yukio, Nakatsu, Kinya
• Application Number:
  US13/028,982
• Publication Number:
  US 20110198919A1
• Time in Patent Office: Days
• US Class Current: 307/9.1
• CPC Class Codes: B60L 15/007 Physical arrangements or structures of drive train converters specially adapted for the propulsion motors of electric vehicles
• CPC Class Codes: B60L 2200/26 Rail vehicles
• CPC Class Codes: B60L 2210/20 AC to AC converters
• CPC Class Codes: B60L 53/20 characterised by converters located in the vehicle
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/1902 including thick film passive components
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: Y02T 10/64 Electric machine technologies in electromobility
• CPC Class Codes: Y02T 10/70 Energy storage systems for electromobility, e.g. batteries
• CPC Class Codes: Y02T 10/7072 : Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
• CPC Class Codes: Y02T 10/72 : Electric energy management in electromobility
• CPC Class Codes: Y02T 90/12 : Electric charging stations
• CPC Class Codes: Y02T 90/14 : Plug-in electric vehicles

Abstract

A circuit board, included in an inverter device that outputs AC current to a motor for driving a vehicle, includes: an insulation layer; a first conductor formed on a first side of the insulation layer, and upon which a semiconductor chip included in a lower arm of an inverter circuit is mounted; a second conductor formed on a second side of the insulation layer opposite to the first side thereof, and connected to a ground of the vehicle; and an inductor connected in parallel with a parasitic capacitance created between the first conductor and the second conductor, thus constituting a parallel resonator together with the parasitic capacitance.

Claims

1. A circuit board included in an inverter device that outputs AC current to a motor for driving a vehicle, comprising:

an insulation layer;

a first conductor formed on a first side of the insulation layer, and upon which a semiconductor chip included in a lower arm of an inverter circuit is mounted;

a second conductor formed on a second side of the insulation layer opposite to the first side thereof, and connected to a ground of the vehicle; and

an inductor connected in parallel with a parasitic capacitance created between the first conductor and the second conductor, thus constituting a parallel resonator together with the parasitic capacitance.

2. A circuit board according to claim 1, further comprising a connecting conductor formed on the first side of the insulation layer,

wherein the inductor is a discrete chip inductor whose one terminal is connected to the second conductor and whose other terminal is connected to the connecting conductor.

3. A circuit board according to claim 2, wherein a discrete chip capacitor is connected in series with the inductor to the connecting conductor.

4. A circuit board according to claim 1, wherein the inductor is configured to have an inductance component by being constituted as a conductor pattern formed on the first side of the insulation layer, the conductor pattern extending from one end portion thereof while curving in a spiral shape centered upon its other end portion, while approaching the other end portion.

5. A circuit board according to claim 2, further comprising a second connecting conductor that electrically connects the connecting conductor formed on the first side of the insulation layer with the second conductor formed on the second side of the insulation layer, and that passes through the insulating layer.

6. A circuit board according to claim 5, wherein the second connecting conductor is a through-hole extending from the first side of the insulation layer to the second side thereof.

7. A circuit board included in an inverter device that outputs AC current to a motor for driving a vehicle, comprising:

an insulation layer;

a first conductor formed on a first side of the insulation layer, and upon which a semiconductor chip included in a lower arm of an inverter circuit is mounted;

a second conductor formed on a second side of the insulation layer opposite to the first side thereof, and connected to a ground of the vehicle;

a middle conductor formed within the insulation layer, and disposed so that its one surface faces towards the first conductor while its other surface faces towards the second conductor; and

an inductor connected in parallel with a first parasitic capacitance created between the first conductor and the middle conductor, with this parallel combination being connected in series with a second parasitic capacitance created between the middle conductor and the second conductor, so that this inductor constitutes a parallel-series resonator together with the first and second parasitic capacitances.

8. A circuit board according to claim 7, wherein the inductor is configured to have an inductance component by being constituted as a conductor pattern formed on the first side of the insulation layer using the first conductor, the conductor pattern extending from one end portion thereof while curving in a spiral shape centered upon its other end portion, while approaching the other end portion.

9. A circuit board according to claim 7, wherein the inductor is configured to have an inductance component by being constituted as a conductor pattern formed within the insulation layer using the middle conductor, the conductor pattern extending from one end portion thereof while curving in a spiral shape centered upon its other end portion, while approaching the other end portion.

10. A circuit board according to claim 7, further comprising:

a connecting conductor formed on the first side of the insulating layer; and

a discrete chip inductor of which one terminal is connected to the middle conductor and the other terminal is connected to the connecting conductor, and that is connected in series with the inductor.