IMAGING DEVICE IN A PROJECTION EXPOSURE FACILITY

• US 20110199597A1
• Filed: 04/28/2011
• Published: 08/18/2011
• Est. Priority Date: 12/19/2001
• Status: Active Grant

• Current Assignee: CARL Zeiss SMT GmbH (Carl-Zeiss-Stiftung)
• Original Assignee: CARL Zeiss SMT GmbH (Carl-Zeiss-Stiftung)
• Inventors: Mühlbeyer, Michael, Fischer, Jurgen, Trossbach, Bärbel, Schöngart, Stefan, Holderer, Hubert, Weber, Jochen, Hummel, Wolfgang, Lippert, Johannes, Weber, Ulrich, Reiner, Raoul, Neumaier, Markus, Rassel, Thorsten, Merz, Erich, Kohl, Alexander, Aubele, Karl-Eugen, Rief, Klaus
• Granted Patent: US 8,514,371 B2
• Time in Patent Office: Days
• US Class Current: 355/55
• CPC Class Codes: G03F 7/70258 Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
• CPC Class Codes: G03F 7/70825 Mounting of individual elements, e.g. mounts, holders or supports workpiece or mask holders G03F7/707

Abstract

An imaging device in a projection exposure machine for microlithography has at least one optical element and at least one manipulator, having a linear drive, for manipulating the position of the optical element. The linear drive has a driven subregion and a nondriven subregion, which are movable relative to one another in the direction of a movement axis. The subregions are interconnected at least temporarily via functional elements with an active axis and via functional elements with an active direction at least approximately parallel to the movement axis.

Claims

1. A system, comprising:

an optical element; and

a manipulator coupled to the optical element,

wherein;

the manipulator is configured so that during operation the manipulator varies the optical element;

the manipulator has a resolution and a range;

a ratio of the resolution to the range is 1;

75,000 or more; and

the system is a microlithography projection system.

2. The system of claim 1, wherein the resolution is from 0.3 nm to 0.8 nm.

3. The system of claim 2, wherein the range is from +80 microns to 200 microns.

4. The system of claim 1, wherein the range is from +80 microns to 200 microns.

5. The system of claim 1, wherein:

the manipulator comprises a first portion and a second portion;

the first portion is fixed with respect to a frame of the system;

the second portion is attached to the optical element; and

the second portion is linearly moveable with respect to the first portion.

6. The system of claim 5, wherein the manipulator further comprises one or more piezoelectric elements that couple the first portion to the second portion.

7. The system of claim 6, wherein the piezoelectric elements comprise shearing piezoelectric elements.

8. The system of claim 6, wherein:

the piezoelectric elements comprise a first piezoelectric element and a second piezoelectric element;

the first piezoelectric element is positioned on a first side of the second portion;

the second piezoelectric element is positioned on a second side of the second portion;

the first side of the second portion is opposite the second side of the second portion; and

during operation, the first and second piezoelectric elements clamp the second portion to position the second portion relative to the first portion.

9. The system of claim 8, wherein the manipulator is within a space between the first and second portions.

10. The system of claim 8, wherein the manipulator is integrated into a mounting apparatus which mounts the optical element to a frame of the system.

11. The system of claim 1, wherein the manipulator is a component of a mounting apparatus which mounts the optical element to a frame of the system.

12. A machine, comprising:

an illumination system; and

a system according to claim 1,

wherein the machine is a microlithography projection exposure machine.

13. A system, comprising:

an optical element;

a frame; and

a mounting apparatus which couples the optical element to the frame, the mounting apparatus comprising;

a first portion fixedly attached to the frame;

a second portion fixedly attached to the optical element; and

a manipulator which couples the first and second portions,

wherein;

the manipulator is configured so that during operation the manipulator varies the optical element;

the manipulator has a resolution and a range;

a ratio of the resolution to the range is 1;

75,000 or more; and

the system is a microlithography projection system.

14. A system, comprising:

an optical element;

a frame;

a sensor; and

a mounting apparatus which couples the optical element to the frame, the mounting apparatus comprising;

a first portion attached to the frame;

a second portion attached to the optical element; and

a manipulator configured so that during operation the manipulator varies the optical element,

wherein;

the manipulator has a resolution and a range;

a ratio of the resolution to the range is 1;

75,000;

the sensor is configured to monitor a position of the optical element relative to the frame; and

the system is a microlithography projection system.

15. The system of claim 14, wherein the sensor is an optical sensor.

16. The system of claim 15, wherein the optical sensor comprises a glass measuring scale.

17. The system of claim 14, wherein the system comprises a plurality of sensors configured to monitor the position of the optical element relative to the frame, and the plurality of sensors are arranged symmetrically with respect to an optical axis of the system.

18. The system of claim 14, wherein the system comprises three sensors and three manipulators, and the three sensors and the three manipulators are arranged symmetrically with respect to an optical axis of the system.

19. The system of claim 14, wherein the sensor is configured to monitor an absolute position of the optical element relative to the frame.

20. The system of claim 14, wherein the sensor is configured to monitor an incremental position of the optical element relative to the frame.