METHOD AND DEVICE FOR PROVIDING ELECTRONIC CIRCUITRY ON A BACKPLATE

• US 20110199668A1
• Filed: 04/22/2011
• Published: 08/18/2011
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Tyger, Karen
• Granted Patent: US 8,090,229 B2
• Time in Patent Office: Days
• US Class Current: 359/291
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G09G 2300/04 Structural and physical details of display devices
• CPC Class Codes: G09G 3/3466 based on interferometric effect
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate may contain electronic circuitry fabricated on the backplane. The electronic circuitry is placed in electrical communication with the array of interferometric modulators and is configured to control the state of the array of interferometric modulators.

Claims

1. A device, comprising:

a transparent substrate;

an array of electromechanical display elements supported by a first surface of said transparent substrate;

a backplane, wherein the backplane is sealed to the first surface of the transparent substrate to form a cavity between the transparent substrate and the backplane, wherein said cavity includes an empty space between at least a portion of the array of electromechanical display elements and the backplane; and

control circuitry fabricated on a first surface of the backplane and configured to control a state of the electromechanical display elements, wherein the control circuitry is in electrical communication with the array of electromechanical display elements.

2. The device of claim 1, wherein the control circuitry includes an application-specific integrated circuit (ASIC).

3. The device of claim 1, further comprising a plurality of electrical connections providing electronic communication between the control circuitry on the backplane and the array of electromechanical display elements.

4. The device of claim 3, wherein the electrical connections include a first conducting material in electronic communication with said ASIC and a second conducting material in electronic communication with said array of interferometric modulators.

5. The device of claim 3, wherein the first conducting material is in electrical communication with the second conducting material through an anisotropic conducting film.

6. The device of claim 3, wherein the electrical connections include a bump of conducting material.

7. The device of claim 3, wherein the electrical connections include a conducting support post.

8. The device of claim 3, wherein the electrical connections include a conducting trace.

9. The device of claim 3, wherein the electrical connections include a bump of conducting material.

10. A method of fabricating a display, comprising:

providing an array of electromechanical display elements supported by a first surface of a transparent substrate;

forming control circuitry on a first surface of a backplate, wherein the electronic circuitry is configured to control the state of said reflective elements; and

sealing the backplate to the first surface of the transparent substrate such that at least a portion of array of electromechanical display elements is spaced apart from at least a portion of the backplate by a cavity and the control circuitry is placed in electrical connection with the array of interferometric modulators.

11. The method of claim 10, wherein the control circuitry includes an application-specific integrated circuit (ASIC).

12. The method of claim 10, wherein the control circuitry is formed by thin film deposition.

13. The method of claim 12, wherein forming electronic circuitry on the first surface of the backplate includes:

depositing a base layer of silicon on said first surface of said backplate; and

depositing a plurality of metal layers on said base layer of silicon.

14. The method of claim 12, wherein forming electronic circuitry on the first surface of the backplate includes:

forming transistors on the first surface of the backplate; and

forming metallic interconnections between the transistors.

15. The method of claim 14, wherein forming electronic circuitry on the first surface of the backplate further includes:

forming metallic connections between the transistors and external electronic circuitry; and

forming metallic connections between the transistors and the array of interferometric modulators.

16. A device, comprising:

a transparent substrate;

an array of electromechanical display elements supported by a first surface of said transparent substrate;

a backplane, wherein the backplane is sealed to the first surface of the transparent substrate to form a cavity between the transparent substrate and the backplane, wherein said cavity includes an empty space between at least a portion of the array of electromechanical display elements and the backplane; and

means for controlling said electromechanical display elements, wherein said controlling means are fabricated on a first surface of the backplane and in electrical communication with the array of electromechanical display elements.

17. The device of claim 16, wherein the controlling means include control circuitry fabricated on a first surface of the backplane.