Sputtering Apparatus, Thin-Film Forming Method, and Manufacturing Method for a Field Effect Transistor

• US 20110201150A1
• Filed: 10/09/2009
• Published: 08/18/2011
• Est. Priority Date: 10/16/2008
• Status: Abandoned Application

• Current Assignee: Ulvac Incorporated
• Original Assignee: Ulvac Incorporated
• Inventors: Ishibashi, Satoru, Saito, Kazuya, Kurata, Takaomi, Akamatsu, Yasuhiko, Arai, Makoto, Kiyota, Junya
• Application Number:
  US13/123,728
• Publication Number:
  US 20110201150A1
• Time in Patent Office: Days
• US Class Current: 438/104
• CPC Class Codes: C23C 14/352 using more than one target C23C14/56 takes precedence
• CPC Class Codes: C23C 14/568 Transferring the substrates through a series of coating stations C23C14/562 takes precedence
• CPC Class Codes: H01J 37/32752 for moving the material across the discharge
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering

Abstract

[Object] To provide a sputtering apparatus, a thin-film forming method, and a manufacturing method for a field effect transistor, which are capable of reducing damage of a base layer.

[Solving Means] The sputtering apparatus 100 includes a conveying mechanism, a first target Tc1, a second target (Tc2 to Tc5), and a sputtering means. The conveying mechanism conveys a supporting portion, which is arranged in an inside of a vacuum chamber and supports a substrate, linearly along a conveying surface parallel to the surface to be processed of the substrate. The first target Tc1 is opposed to the conveying surface with a first space therebetween. The second target (Tc2 to Tc5) is arranged on a downstream side in a conveying direction of the substrate with respect to the first target Tc1, and is opposed to the conveying surface with a second space smaller than the first space therebetween. The sputtering means sputters each target. According to this sputtering apparatus 100, the damage received by the base layer is small, and hence it is possible to form a thin-film having good film-forming properties.

Claims

1. A sputtering apparatus for forming a thin-film on a surface to be processed of a substrate, comprising:

a vacuum chamber capable of keeping a vacuum state;

a supporting portion, which is arranged in an inside of the vacuum chamber, and supports the substrate;

a conveying mechanism, which is arranged in the inside of the vacuum chamber, and linearly conveys the supporting portion along a conveying surface parallel to the surface to be processed;

a first target opposed to the conveying surface with a first space therebetween;

a second target, which is arranged on a downstream side in a conveying direction of the substrate with respect to the first target, and is opposed to the conveying surface with a second space smaller than the first space therebetween; and

a sputtering means for sputtering the first target and the second target.

2. The sputtering apparatus according to claim 1, wherein

the conveying mechanism conveys the substrate while sequentially passing through a fist position and a second position,

the first position is a position in which only sputtered particles obliquely emitted from the first target arrive at the surface to be processed, and

the second position is a position in which sputtered particles perpendicularly emitted from the second target arrive at the surface to be processed.

3. The sputtering apparatus according to claim 2, wherein

a surface to be sputtered of the first target is arranged in parallel to the conveying surface.

4. The sputtering apparatus according to claim 2, wherein

a surface to be sputtered of the first target is arranged on a side of the second position.

5. A thin-film forming method, comprising:

arranging a substrate, which has a surface to be processed, in a vacuum chamber provided with a first target opposed to a conveying surface of the substrate with a first space therebetween and with a second target opposed to the conveying surface of the substrate with a second space smaller than the first space therebetween;

conveying the substrate from a first position to a second position;

subjecting, in the first position, the surface to be processed to film formation using only sputtered particles obliquely emitted by sputtering the first target; and

subjecting, in the second position, the surface to be processed to film formation using sputtered particles perpendicularly emitted by sputtering the second target.

6. A manufacturing method for a field effect transistor, comprising:

forming a gate insulating film on a substrate;

arranging a substrate in a vacuum chamber provided with a first target, which has In—

Ga—

Zn—

O-based composition and is opposed to a conveying surface of the substrate with a first space therebetween, and with a second target, which has In—

Ga—

Zn—

O-based composition and is opposed to the conveying surface of the substrate with a second space smaller than the first space therebetween;

conveying the substrate from a first position to a second position; and

subjecting, in the first position, the surface to be processed to film formation using only sputtered particles obliquely emitted by sputtering the first target and subjecting, in the second position, the surface to be processed to film formation using sputtered particles perpendicularly emitted by sputtering the second target, to thereby form an active layer.