METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A MULTILEVEL CONDUCTIVE TRACE
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Abstract
A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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Citations
70 Claims
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1-35. -35. (canceled)
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36. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, a first adhesive, a second adhesive, a substrate and a conductive layer, wherein the post is adjacent to the base, extends above the base in an upward direction, extends into a first opening in the first adhesive and is aligned with a second opening in the second adhesive, a hole in the conductive layer and an aperture in the substrate, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the second adhesive is mounted on and extends above the base and is non-solidified, the substrate is mounted on and extends above the second adhesive, wherein the substrate includes a first conductive segment, a second conductive segment and a dielectric layer, the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer and the dielectric layer is solidified, the first adhesive is mounted on and extends above the substrate and is non-solidified, and the conductive layer is mounted on and extends above the first adhesive;
thenflowing the first adhesive into and upward in a first gap located in the hole between the post and the conductive layer; flowing the second adhesive into and upward in a second gap located in the aperture between the post and the substrate; solidifying the adhesives;
thenproviding a conductive trace that includes a pad, a terminal, a conductive pattern, a first via, a second via and a selected portion of the conductive layer, wherein the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via extends to the conductive pattern, the second via extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via;
thenmounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing a first adhesive, wherein a first opening extends through the first adhesive; providing a second adhesive, wherein a second opening extends through the second adhesive; providing a conductive layer, wherein a hole extends through the conductive layer; providing a substrate that includes a first conductive segment, a second conductive segment and a dielectric layer, wherein an aperture extends through the substrate; mounting the second adhesive on the base, including inserting the post into the second opening, wherein the second adhesive extends above the base and is non-solidified; mounting the substrate on the second adhesive, including aligning the post with the aperture, wherein the substrate extends above the second adhesive, the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer and the dielectric layer is solidified; mounting the first adhesive on the substrate, including aligning the post with the first opening, wherein the first adhesive extends above the substrate and is non-solidified; mounting the conductive layer on the first adhesive, including aligning the post with the hole, wherein the conductive layer extends above the first adhesive;
thenapplying heat to melt the adhesives; moving the base and the conductive layer towards one another, thereby moving the post upward in the hole and the aperture, applying pressure to the molten first adhesive between the conductive layer and the substrate, applying pressure to the molten second adhesive between the base and the substrate, forcing the molten first adhesive to flow into and upward in a first gap located in the hole between the post and the conductive layer and forcing the molten second adhesive to flow into and upward in a second gap located in the aperture between the post and the substrate; applying heat to solidify the molten adhesives, thereby mechanically attaching the post to the conductive layer, the post to the substrate, the base to the substrate and the conductive layer to the substrate;
thenproviding a conductive trace that includes a pad, a terminal, a conductive pattern, a first via, a second via and a selected portion of the conductive layer, wherein the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via extends to the conductive pattern, the second via extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via;
thenmounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the post, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55)
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56. A method of making a semiconductor chip assembly, comprising:
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providing a post, a base, a first adhesive, a second adhesive, a substrate and a conductive layer, wherein the post is adjacent to and integral with the base, extends above the base in an upward direction, extends through a first opening in the first adhesive into an aperture in the substrate and is aligned with a second opening in the second adhesive and a hole in the conductive layer, the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions, the second adhesive is mounted on and extends above the base, contacts and is sandwiched between the base and the substrate and is non-solidified, the substrate is mounted on and extends above the second adhesive and contacts and is sandwiched between the adhesives, wherein the substrate includes a first conductive segment, a second conductive segment and a dielectric layer, the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer and the dielectric layer contacts and is sandwiched between the conductive segments and is solidified, the first adhesive is mounted on and extends above the substrate, contacts and is sandwiched between the conductive layer and the substrate and is non-solidified, and the conductive layer is mounted on and extends above the first adhesive;
thenflowing the first adhesive into and upward in a first gap located in the hole between the post and the conductive layer; flowing the second adhesive into and upward in a second gap located in the aperture between the post and the substrate; flowing the adhesives into contact with one another; solidifying the adhesives;
thenproviding a conductive trace that includes a pad, a terminal, a conductive pattern, a first via, a second via and a selected portion of the conductive layer, wherein the pad is located above the substrate, the terminal is located below the substrate, the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via extends through the first adhesive and extends to the conductive pattern, the second via extends through the second adhesive and extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via; providing a cap that extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post and that overlaps the aperture and includes a selected portion of the conductive layer;
thenmounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (57, 58, 59, 60, 61, 62, 63, 64, 65)
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66. A method of making a semiconductor chip assembly, comprising:
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providing a post and a base, wherein the post is adjacent to and integral with the base and extends above the base in an upward direction, and the base extends below the post in a downward direction opposite the upward direction and extends laterally from the post in lateral directions orthogonal to the upward and downward directions; providing a first adhesive, wherein a first opening extends through the first adhesive; providing a second adhesive, wherein a second opening extends through the second adhesive; providing a conductive layer, wherein a hole extends through the conductive layer; providing a substrate that includes a first conductive segment, a second conductive segment and a dielectric layer, wherein an aperture extends through the substrate; mounting the second adhesive on the base, including inserting the post into the second opening, wherein the second adhesive contacts and extends above the base and is non-solidified; mounting the substrate on the second adhesive, including inserting the post into the aperture, wherein the substrate contacts and extends above the second adhesive, the first conductive segment is attached to and extends above the dielectric layer, the second conductive segment is attached to and extends below the dielectric layer and the dielectric layer contacts and is sandwiched between the conductive segments and is solidified; mounting the first adhesive on the substrate, including inserting the post into the first opening, wherein the first adhesive contacts and extends above the substrate and is non-solidified; mounting the conductive layer on the first adhesive, including aligning the post with the hole, wherein the conductive layer contacts and extends above the first adhesive;
thenapplying heat to melt the adhesives; moving the base and the conductive layer towards one another, thereby moving the post upward in the hole and the aperture, applying pressure to the molten first adhesive between the conductive layer and the substrate, applying pressure to the molten second adhesive between the base and the substrate, forcing the molten first adhesive to flow into and upward in a first gap located in the hole between the post and the conductive layer, forcing the molten second adhesive to flow into and upward in a second gap located in the aperture between the post and the substrate and forcing the molten adhesives to contact and merge with one another; applying heat to solidify the molten adhesives, thereby mechanically attaching the post to the conductive layer, the post to the substrate, the base to the substrate and the conductive layer to the substrate;
thenproviding a conductive trace that includes a pad, a terminal, a conductive pattern, a first via, a second via and a selected portion of the conductive layer, wherein the pad is located above the substrate, the terminal is located below the substrate, the conductive pattern is a part of the substrate and includes the first and/or second conductive segment, the first via extends through the first adhesive and extends to the conductive pattern, the second via extends through the second adhesive and extends to the conductive pattern and an electrically conductive path between the pad and the terminal includes the conductive pattern and the vias, an electrically conductive path between the pad and the conductive pattern includes the first via and an electrically conductive path between the terminal and the conductive pattern includes the second via; providing a cap that extends above and is adjacent to and covers in the upward direction and extends laterally from a top of the post and that covers the aperture in the upward direction and includes a selected portion of the conductive layer;
thenmounting a semiconductor device on the cap, wherein a heat spreader includes the post, the base and the cap and the semiconductor device overlaps the post; electrically connecting the semiconductor device to the pad, thereby electrically connecting the semiconductor device to the terminal; and thermally connecting the semiconductor device to the cap, thereby thermally connecting the semiconductor device to the base. - View Dependent Claims (67, 68, 69, 70)
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Specification