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TEST POINT DESIGN FOR A HIGH SPEED BUS

  • US 20110203840A1
  • Filed: 02/23/2010
  • Published: 08/25/2011
  • Est. Priority Date: 02/23/2010
  • Status: Active Grant
First Claim
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1. A test point design comprising;

  • a. a circuit board comprising a plurality of layers including a power plane and a ground plane, the circuit board further comprises a differential pair of signal lines including a first signal line and a second signal line; and

    a pair of test point pads including a first test point pad connected to the first signal line and a second test point pad connected to the second signal line, wherein a first portion of the power plane and a first portion of the ground plane below the first test point pad are removed and a second portion of the power plane and a second portion of the ground plane below the second test point pad are removed.

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