Vapor Deposition of a Layer
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Abstract
A method of depositing a layer onto a substrate, comprising heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited, dispensing into the evaporator one or more quantized units of the evaporant where the evaporant is completely vaporized, providing an area vapor dispenser having a plurality of apertures, and directing the vaporized evaporant from the evaporator to the area vapor dispenser so that the evaporant is dispensed through the apertures to deposit the layer on the substrate.
14 Citations
22 Claims
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1-17. -17. (canceled)
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18. Apparatus for depositing a layer onto a substrate, comprising:
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a) a platform for mounting the substrate; b) an area vapor dispenser positioned relative to the substrate platform and having a plurality of apertures; c) a heated evaporator capable of completely evaporating the evaporant to be deposited; d) a material dispenser for dispensing into the evaporator quantized units of the evaporant so as to completely vaporize such evaporant; and e) means for directing the vaporized evaporant from the evaporator to the area vapor dispenser so that the evaporant is dispensed through the apertures to deposit the layer on the substrate. - View Dependent Claims (19, 20, 21, 22)
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Specification