Solid State Light Sheet or Strip Having Cavities Formed in Top Substrate
First Claim
1. A lighting device comprising:
- a first substrate having first connection locations electrically connected to first conductors formed on the first substrate;
a plurality of non-packaged light emitting diode (LED) dies, each die having at least a first die electrode and a second die electrode, the first die electrode of associated dies being aligned with and electrically connected to an associated first connection location on the first substrate without wire bonds; and
a second substrate, the second substrate having a plurality of indentions accommodating at least a portion of a thickness of the dies,wherein the plurality of dies are sandwiched between the first substrate and the second substrate, wherein portions of the first conductors create a series connection of the dies without using wire bonds, and wherein the second substrate has light passing locations for emitting light.
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Accused Products
Abstract
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
131 Citations
20 Claims
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1. A lighting device comprising:
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a first substrate having first connection locations electrically connected to first conductors formed on the first substrate; a plurality of non-packaged light emitting diode (LED) dies, each die having at least a first die electrode and a second die electrode, the first die electrode of associated dies being aligned with and electrically connected to an associated first connection location on the first substrate without wire bonds; and a second substrate, the second substrate having a plurality of indentions accommodating at least a portion of a thickness of the dies, wherein the plurality of dies are sandwiched between the first substrate and the second substrate, wherein portions of the first conductors create a series connection of the dies without using wire bonds, and wherein the second substrate has light passing locations for emitting light. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification