TEST APPARATUS HAVING A PROBE CORE WITH A TWIST LOCK MECHANISM

• US 20110204912A1
• Filed: 01/20/2011
• Published: 08/25/2011
• Est. Priority Date: 01/20/2010
• Status: Active Grant

• Current Assignee: Celadon Systems, Inc.
• Original Assignee: Celadon Systems, Inc.
• Inventors: Root, Bryan J., Funk, William A.
• Granted Patent: US 8,674,715 B2
• Time in Patent Office: Days
• US Class Current: 324/754.07
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/09027 Non-rectangular flat PCB, e.g. circular
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

Claims

1. A probe apparatus for testing a semiconductor device comprising:

a circuit board having a pattern of signal contacts and a pattern of guard contacts, the circuit board configured as a plate having a top side, a bottom side, and an opening through the top and bottom sides; and

a probe core insertable into the opening and configured to be connected and disconnected with the circuit board, the probe core having a frame, a probe tile and a wire guide that support a plurality of probe wires, the plurality of probe wires having an end configured to probe a semiconductor device, and the plurality of probe wires such that each wire has a signal transmitting portion that matches a portion of a respective signal contact in the pattern of signal contacts, and such that each wire has a guard portion that matches a portion of a respective guard contact in the pattern of signal contacts; and

a lock mechanism supported on the frame of the probe core,

wherein the probe core is lockable onto the circuit board.

2. The test apparatus of claim 1, wherein the probe core is rotatably-lockable onto the circuit board, the frame being rotatable relative to the wire guide to lock the probe core onto the circuit board.

3. The test apparatus of claim 1, wherein the lock mechanism comprises a ramped protrusion and a handle, the ramped protrusion having a detent configured to allow the probe core to lock onto the circuit board, and the handle is configured to allow a user to rotate the probe core to lock and unlock the probe core from the circuit board.

4. The test apparatus of claim 1, wherein the wire guide comprises a groove structure to support each wire, the groove structure supports a portion of the signal transmission portion and the guard portion.

5. The test apparatus of claim 4, wherein the groove structure include a plurality of grooves, where each groove has a radiused surface, the radiused surface providing an alignment feature for the probe wires when assembled with the wire guide.

6. The test apparatus of claim 1, wherein the wire guide comprises at least one hole viewable of one of the wires of the plurality of wires, the hole configured to allow confirmation position of the respective wire.

7. The test apparatus of claim 1, further comprising a detent bump on the frame that cooperates with a detent slot on the wire guide, when the frame is rotated relative to the wire guide, the detent bump is in contact with and slides along the detent slot and is limited to movement of the frame within the radius of the detent slot.

8. The test apparatus of claim 1, wherein the frame and wire guide are constructed of different materials.

9. The test apparatus of claim 1, wherein the circuit board comprises a notch, and the probe core comprises a protrusion, the protrusion is configured to be placed in the notch to align the probe core onto the circuit board.

10. The test apparatus of claim 1, wherein the circuit board comprises a guard plate disposed thereon.

11. The test apparatus of claim 1, wherein the wire guide comprises a tag thereon to identify the apparatus and to protect the probe core.

12. The test apparatus of claim 1, wherein the probe core comprises a state indicator to confirm alignment of the probe core with the circuit board.

13. A probe core comprising:

a frame;

a wire guide supported by the frame, the frame being rotatable relative to the wire guide;

a probe tile connected to the wire guide;

a plurality of probe wires supported by the wire guide and probe tile, each wire includes an end configured to probe a semiconductor device, each wire includes a signal transmitting portion and a guard portion; and

a lock mechanism supported by the frame such that the frame is rotatable relative to the wire guide and probe tile,

wherein the lock mechanism is configured to allow the probe core to be connected and disconnected to a circuit board in twist lock and unlock operation through rotation of the frame relative to the wire guide and probe tile.

14. A method for assembling a probe card onto a circuit board comprising

aligning a probe card with a circuit board, the probe card having a plurality probe wires, where each wire has a signal transmitting portion and a guard portion, and the circuit board having a pattern of signal contacts and a pattern of guard contacts;

inserting the probe card into the circuit board; and

rotating the probe card with respect to the circuit board to thereby lock the probe card onto the circuit board,

wherein by the aligning step, each probe wire has its signal transmitting portion respectively aligned and in contact with a portion of a respective signal contact of the pattern of signal contacts and each probe wire has its guard portion respectively aligned and in contact with a portion of a respective guard contact of the pattern of guard contacts, and

wherein by rotating step, a portion of the probe card is rotated relative to the circuit board, while the probe wires remain aligned with respect to the pattern of signal contacts and the pattern of guard contacts on the circuit board.