ELECTRONIC COMMUNICATIONS DEVICE WITH ANTENNA AND ELECTROMAGNETIC SHIELD

• US 20110205028A1
• Filed: 02/23/2011
• Published: 08/25/2011
• Est. Priority Date: 02/25/2010
• Status: Active Grant

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: GIRLANDO, Giovanni, FINOCCHIARO, Alessandro, PAGANI, Alberto
• Granted Patent: US 9,112,263 B2
• Time in Patent Office: Days
• US Class Current: 340/10.1
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: H01L 21/268 using electromagnetic radiation, e.g. laser radiation
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 2223/6672 for integrated passive components, e.g. semiconductor device with passive components only integrated circuits with passive components only per se H01L27/01
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5225 Shielding layers formed together with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 28/40 Capacitors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/526 Electromagnetic shields
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part

Abstract

An embodiment of an electronic communications device, including: a body of semiconductor material defining at least one integrated electronic circuit and having a top surface; an electromagnetic shield; a radiant element; and a capacitive element formed by a first electrode and a second electrode, the radiant element being set on the top surface and being ohmically coupled to the first electrode and the second electrode by means of a first connection element and a second connection element, respectively, the electromagnetic shield being set between the radiant element and the top surface and forming at least the second electrode.

Claims

1. An electronic communications device, comprising:

a body of semiconductor material defining at least one integrated electronic circuit and having a top surface;

an electromagnetic shield;

a radiant element; and

a capacitive element formed by a first electrode and a second electrode, said radiant element being set on said top surface and being ohmically coupled to said first electrode and said second electrode, respectively, by means of a first connection element and a second connection element, said electromagnetic shield being set between said radiant element and said top surface;

wherein said electromagnetic shield forms at least said second electrode.

2. The electronic device according to claim 1, further comprising a top region of dielectric material, laid on said body of semiconductor material, and an insulating layer, which extends over said top region, said electromagnetic shield extending between said top region and said insulating layer, said first and second connection elements comprising, respectively, a first via and a second via passing through the insulating layer.

3. The electronic device according to claim 2, wherein said electromagnetic shield also forms said first electrode, said first electrode and said second electrode being comb-fingered in such a way that said capacitive element is of a planar type.

4. The electronic device according to claim 2, wherein said electromagnetic shield also forms a first portion of said first electrode.

5. The electronic device according to claim 4, wherein said first portion of the first electrode and said second electrode are comb-fingered with respect to one another.

6. The electronic device according to claim 4, wherein said first electrode further comprises a second portion, ohmically coupled to said first portion and set on said first portion.

7. The electronic device according to claim 6, wherein said second portion of said first electrode extends over said insulating layer and is coplanar with said radiant element.

8. The electronic device according to claim 6, wherein said radiant element is coupled to said first portion of said first electrode and to said second electrode by means of said first and second vias, and wherein said second portion is coupled to said first portion by means of a third via passing through the insulating layer.

9. The electronic device according to claim 6, wherein said radiant element is coupled to said first portion of said first electrode and to said second electrode by means of said first and second vias, and wherein said second portion is in direct electrical contact with said radiant element.

10. The electronic device according to claim 2, wherein said electromagnetic shield also forms said first electrode and a third electrode, said first electrode being set between, and comb-fingered to, said second and third electrodes, said radiant element being formed by a conductive element having a start terminal, an end terminal, and an intermediate point, said second electrode and said third electrode being, respectively, coupled to said start terminal and to said end terminal by means of said second via and a fourth via, said first electrode being coupled to said intermediate point by means of said first via passing through said insulating layer.

11. The electronic device according to claim 2, wherein said integrated electronic circuit comprises a first sub-circuit and a second sub-circuit, which are ohmically coupled to said first electrode and said second electrode by means of pairs of respective pads that extend over said top region.

12. The device according to claim 1, wherein said radiant element is formed by a plurality of conductive turns, from which a plurality of conductive segments depart, which are coupled, by means of respective vias, to the first electrode.

13. A method for manufacturing an integrated electronic device, comprising:

providing a body of semiconductor material;

forming an integrated electronic circuit;

forming an electromagnetic shield above the integrated electronic circuit;

forming a radiant element above the electromagnetic shield;

forming a first electrode and a second electrode of a capacitive element above the integrated electronic circuit, wherein said electromagnetic shield forms at least said second electrode;

calibrating the integrated electronic device by means of at least one between the following steps;

modifying a geometrical shape of the radiant element;

modifying a geometrical shape of the first electrode or second electrode.

14. The manufacturing method according to claim 13, wherein the step of forming the first electrode comprises forming a first portion coplanar to the first electrode and a second portion coplanar to the radiant element, and wherein the step of modifying a geometrical shape of the first electrode or of the second electrode comprises modifying the geometrical shape of the second portion of said first electrode.

15. The manufacturing method according to claim 13, wherein the steps of modifying a geometrical shape comprise carrying out a laser irradiation.

16. The manufacturing method according to claim 15, wherein said step of forming a radiant element comprises forming a plurality of conductive turns from which a plurality of conductive segments depart, which are coupled, by means of respective vias, to the first electrode, and wherein the step of modifying a geometrical shape of the radiant element comprises ohmically uncoupling at least one between said conductive segments from said conductive turns, thereby varying an inductance associated with said radiant element.

17. An apparatus, comprising:

a circuit element;

an antenna disposed over the circuit element; and

a first capacitor having a first plate coupled to the antenna and having a second plate, a first portion of one of the first and second plates disposed between the circuit element and the antenna.

18. The apparatus of claim 17 wherein the first portion comprises the entirety of the one of the first and second plates.

19. The apparatus of claim 17 wherein the circuit element comprises a transistor.

20. The apparatus of claim 17 wherein the circuit element is coupled to the antenna.

21. The apparatus of claim 17, further comprising a circuit that includes the circuit element.

22. The apparatus of claim 17, further comprising a transmitter that is coupled to the antenna and that includes the circuit element.

23. The apparatus of claim 17, further comprising a receiver that is coupled to the antenna and that includes the circuit element.

24. The apparatus of claim 17 wherein the antenna comprises multiple turns of a conductor.

25. The apparatus of claim 17, further comprising:

a level; and

wherein the antenna comprises multiple turns of a conductor disposed at the level.

26. The apparatus of claim 17, further comprising:

levels; and

wherein the antenna comprises multiple turns of a conductor disposed at multiple ones of the levels.

27. The apparatus of claim 17 wherein the second plate of the capacitor is coupled to the antenna.

28. The apparatus of claim 17, further comprising:

levels;

wherein the antenna is disposed at one of the levels;

wherein the first portion of the one of the first and second plates is disposed at another of the levels; and

wherein a second portion of the one of the first and second plates is disposed at the one of the levels.

29. The apparatus of claim 17, further comprising:

levels;

wherein the antenna is disposed at one of the levels;

wherein the first portion of the one of the first and second plates is disposed at another of the levels; and

wherein a second portion of the one of the first and second plates is disposed at the other of the levels.

30. The apparatus of claim 17, further comprising:

levels;

wherein the antenna is disposed at one of the levels;

wherein the first portion of the one of the first and second plates is disposed at another of the levels; and

wherein a portion of the other of the first and second plates is disposed at the other of the levels.

31. The apparatus of claim 17, further comprising:

levels;

wherein the antenna is disposed at one of the levels;

wherein the first portion of the one of the first and second plates is disposed at another of the levels; and

wherein a portion of the other of the first and second plates is disposed at the one of the levels.

32. The apparatus of claim 17, further comprising:

wherein the first portion of the one of the first and second plates has fingers; and

wherein a portion of the other of the first and second plates has fingers that are disposed between the fingers of the first portion of the one of the first and second plates.

33. The apparatus of claim 17, further comprising a second capacitor having a third plate coupled to the antenna and having one of the first and second plates.

34. An apparatus, comprising:

a circuit element;

an antenna disposed over the circuit element; and

a first capacitor having a first plate coupled to the antenna and having a second plate, at least a first portion of the first plate disposed between the circuit element and the antenna.

35. The apparatus of claim 34 wherein the second plate of the capacitor is disposed adjacent to the first plate and is coupled to the antenna.

36. The apparatus of claim 34 wherein:

the first portion of the first plate has extensions; and

the second plate of the capacitor is coupled to the antenna and has extensions that extend between the extensions of the first portion of the first plate.

37. The apparatus of claim 34 wherein the first plate includes a second portion that is adjacent to the antenna.

38. The apparatus of claim 34, further comprising:

wherein the second plate is adjacent to the first portion of the first plate; and

a second capacitor including the second plate and including a third plate that is coupled to the antenna and that is adjacent to the first portion of the first plate and to the second plate.

39. The apparatus of claim 34, further comprising:

wherein the second plate is adjacent to the first portion of the first plate;

a second capacitor including the second plate and including a third plate that is coupled to the antenna and that is adjacent to the first portion of the first plate and to the second plate; and

a third capacitor including the second plate and including a fourth plate that is coupled to the antenna and that is adjacent to the antenna.

40. A system, comprising:

a first apparatus, comprising;

a circuit element;

an antenna disposed over the circuit element; and

a first capacitor having a first plate coupled to the antenna and having a second plate, a first portion of one of the first and second plates disposed between the circuit element and the antenna; and

a second apparatus operable to communicate with the first apparatus.

41. The system of claim 40 wherein the second apparatus comprises an RFID reader.

42. An integrated circuit, comprising:

a circuit element;

an antenna disposed over the circuit element; and

a first capacitor having a first plate coupled to the antenna and having a second plate, a first portion of one of the first and second plates disposed between the circuit element and the antenna.

43. A method, comprising:

energizing an antenna and a capacitor coupled to the antenna; and

shielding a circuit element from the energized antenna with a portion of a plate of the capacitor.

44. The method of claim 43 wherein energizing the antenna comprises driving the antenna with a signal.

45. The method of claim 43 wherein energizing the antenna comprises receiving a signal with the antenna.

46. The method of claim 43, further comprising:

wherein energizing the antenna comprises driving the antenna with a first signal; and

determining a resonant frequency of the antenna in response to a second signal received from the energized antenna.

47. The method of claim 43, further comprising altering a resonant frequency of the antenna by altering the antenna.

48. The method of claim 43, further comprising altering a resonant frequency of the antenna by altering the capacitor.

49. The method of claim 43, further comprising altering a resonant frequency of the antenna by altering a plate of the capacitor.