APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF LIGHT EMITTING DIODES

• US 20110205702A1
• Filed: 05/05/2011
• Published: 08/25/2011
• Est. Priority Date: 11/19/2007
• Status: Active Grant

• Current Assignee: Revolution Lighting Technologies, Inc.
• Original Assignee: Nexxus Lighting, Inc.
• Inventors: GRAJCAR, Zdenko
• Granted Patent: US 8,564,956 B2
• Time in Patent Office: Days
• US Class Current: 361/692
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins

Abstract

An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB'"'"'s may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Claims

1-24. -24. (canceled)

25. An apparatus comprising:

a first printed circuit board (PCB) that includes a first PCB first surface;

an electronics package configured to be disposed on the first PCB first surface;

a second PCB; and

wherein the first PCB further includes a first PCB second surface, the first PCB comprises;

a first core that includes a first core first surface and a first core second surface;

a first metal layer configured to define a first trace disposed on the first core first surface;

and

a second metal layer configured to define a second trace disposed on the first core second surface,

wherein the first trace is in electrical communication with the second trace, and

wherein the electronics package is in electrical communication with the first trace,

wherein the second PCB includes a second PCB first surface and a second PCB second surface, the second PCB comprises;

a second core that includes a second core first surface and a second core second surface;

a third metal layer configured to define a third trace disposed on the second core first surface; and

a fourth metal layer configured to define a fourth trace disposed on the second core second surface,

wherein the third trace is in electrical communication with the fourth trace,

a plurality of pins configured to pass from the first core first surface to the first core second surface to conduct heat generated by the electronics package through the first core and to disperse heat, and wherein at least one of the plurality of pins engages the third trace, the fourth trace, the first trace and the second trace such that the first trace and the second trace are in electrical communication with the third trace and the fourth trace, respectively.

26. The apparatus of claim 25, wherein the electronics package comprises at least one of a lighting device, a telecommunications device, a computer device, or a memory device.

27. The apparatus of claim 26, wherein the lighting device comprises a light emitting diode (LED).

28. The circuit of claim 25, wherein the second PCB comprises a circuit driver that is in electrical communication with the third trace and the fourth trace.

29. The apparatus of claim 25, further comprising:

at least one power connector connected to the second PCB to communicate electric power from a source to the second PCB.

30. The apparatus of claim 25, further comprising a housing to house the first PCB and the second PCB.

31. The apparatus of claim 30, wherein the housing comprises openings that permit air flow into an interior of the housing for dissipating heat.

32. The apparatus according to claim 25, wherein at least one of the plurality of pins comprises a flat surface to permit air flow along the flat surface for heat dispersion.

33. The apparatus of claim 25, further comprising a pad disposed about the first PCB first surface, wherein the pad is in thermal communication with the electronic package.

34. The apparatus of claim 33, further comprising a heat slug disposed against the pad.

35. The apparatus of claim 34, wherein the means for connecting contacts at least one of the pad and the slug.

36. An apparatus comprising:

a first printed circuit board (PCB) having a first surface and a second surface;

an electronics package configured to be disposed on the PCB;

a second PCB;

means for connecting the first PCB with the second PCB and for creating an interval therebetween and for conveying heat from the electronics package into the interval;

a first trace configured on the first surface of the first PCB, and the first trace in electrical communication with the electronics package;

a second trace configured on the second surface of the first PCB, wherein a first core is disposed between the first trace and second trace;

a third trace disposed on a first surface of the second PCB;

a fourth trace disposed on a second surface of the second PCB;

wherein the first trace and second trace are in electrical communication, wherein the third trace and fourth trace are in the electrical communication, and

wherein the means for connecting also engages the third trace, the fourth trace, the first trace and the second trace, such that the first trace and the second trace are in electrical communication with the third trace and fourth trace, respectively.

37. An apparatus comprising:

A printed circuit board (PCB) having a metal layer disposed on a first surface of the PCB;

a core having a core first surface and a core second surface;

a backplane having a backplane first surface and a backplane second surface, the backplane first surface abutting the core first surface;

a pad defined by a portion of the metal layer;

a heat slug having a heat slug first surface and a heat slug second surface, the heat slug second surface secured to the pad;

an electronics package disposed against the heat slug first surface to conduct heat away from the electronics package to the backplane; and

means for conducting heat from the electronics package, the heat slug and the pad, wherein the means for conducting heat remains electronically isolated from the core.

38. The apparatus of claim 37, wherein the means for conducting heat remains electrically isolated from the backplane, with passing through the backplane.

39. The apparatus of claim 37, wherein the means for conducting is in electrical communication with the electronics package.

40. The apparatus of claim 37, wherein the means for conducting is electrically non-conducting.

41. The apparatus of claim 37, wherein the means for conducting is configured to pass through the core, the heat slug and the backplane.

42. The apparatus of claim 41, wherein the means for conducting passes through the metal layer.