SYSTEM AND METHOD FOR PROVIDING A LOW AND NARROW-PROFILE RADIO FREQUENCY IDENTIFICATION (RFID) TAG
First Claim
1. A wireless communication device, comprising:
- a radio frequency identification (RFID) tag, comprising;
an RFID circuit packaged within a chip carrier package, wherein the chip carrier package bonds out at least a first antenna connection for the RFID circuit;
an antenna including at least a first conductive lead interfaced with the at least the first antenna connection;
a first spacer having a first dielectric constant, wherein the chip carrier package and the at least the first conductive lead are coupled to a first side of the first spacer; and
a second spacer having a second dielectric constant greater than the first dielectric constant and coupled to a second side of the first spacer, wherein the second spacer is adapted to isolate the RFID circuit from a metal surface.
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Accused Products
Abstract
Methods and systems for wireless devices are disclosed. According to one system, a radio frequency identification (RFID) tag includes an RFID circuit packaged within a chip carrier package. The chip carrier package bonds out a first antenna connection for the RFID circuit. An antenna including a conductive lead is interfaced with the first antenna connection. The chip carrier package and the first conductive lead are coupled to a first side of a first spacer. A second spacer having a second dielectric constant greater than the first dielectric constant is coupled to a second side of the first spacer. The second spacer isolates the RFID circuit from a metal surface.
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Citations
28 Claims
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1. A wireless communication device, comprising:
a radio frequency identification (RFID) tag, comprising; an RFID circuit packaged within a chip carrier package, wherein the chip carrier package bonds out at least a first antenna connection for the RFID circuit; an antenna including at least a first conductive lead interfaced with the at least the first antenna connection; a first spacer having a first dielectric constant, wherein the chip carrier package and the at least the first conductive lead are coupled to a first side of the first spacer; and a second spacer having a second dielectric constant greater than the first dielectric constant and coupled to a second side of the first spacer, wherein the second spacer is adapted to isolate the RFID circuit from a metal surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of manufacture for a wireless communication device, comprising the steps of:
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manufacturing a radio frequency identification (RFID) tag, wherein the RFID tag is manufactured by; placing an RFID circuit within a chip carrier package, wherein the chip carrier package bonds out at least a first antenna connection for the RFID circuit; attaching an antenna to the RFID circuit, wherein the antenna includes at least a first conductive lead interfaced with the at least the first antenna connection; coupling a first side of a first spacer having a first dielectric constant to the chip carrier package and the at least the first conductive lead; and coupling a second spacer having a second dielectric constant greater than the first dielectric constant to a second side of the first spacer, wherein the second spacer is adapted to isolate the RFID circuit from a metal surface.
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Specification