MULTI-CHIP PACKAGE WITH IMPROVED SIGNAL TRANSMISSION

• US 20110210419A1
• Filed: 12/31/2010
• Published: 09/01/2011
• Est. Priority Date: 02/26/2010
• Status: Active Grant

• Current Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Original Assignee: Hynix Semiconductor Incorporated (SK Hynix Inc.)
• Inventors: KIM, Yang Hee, LEE, Jun Ho, KIM, Hyun Seok, CHO, Sun Ki, JUNG, Boo Ho, KIM, Young Won
• Granted Patent: US 8,633,568 B2
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13599 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29599 Material
• CPC Class Codes: H01L 2225/06531 Non-galvanic coupling, e.g. capacitive coupling
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Provided is an MCP including a plurality chips stacked therein. Each of the chips includes a plurality of inductor pads configured to transmit power or signals, and at both sides of a reference inductor pad, a first and a second inductor pads are formed to generate magnetic fluxes in different directions from each other.

Claims

1. A multi-chip package (MCP) having a plurality of chips comprising:

a plurality of inductor pads in each of the chips, wherein

at both sides of a reference inductor pad where is one pad of the inductor pads, first and second inductor pads are formed to generate magnetic fluxes in different directions from each other and the closest pads to the reference inductor pad are the first and second inductor pads

2. The MCP according to claim 1, wherein each of the inductor pads comprises a coil which determines the magnetic flux direction.

3. The MCP according to claim 2, wherein any one of the first and second inductor pads is configured to have the same magnetic flux direction as that of the reference inductor pad.

4. The MCP according to claim 2, wherein any one of the first and second inductor pads is configured to have the opposite magnetic flux direction to that of the reference inductor pad.

5. The MCP according to claim 2, wherein the plurality of inductor pads are arranged in line on each of the first and second chips.

6. The MCP according to claim 2, wherein the plurality of inductor pads are arranged in a zigzag shape on each of the first and second chips.

7. The MCP according to claim 1, wherein at least one of the inductor pads is used to transmit power.

8. The MCP according to claim 1, wherein at least one of the inductor pads is used to transmit a signal.

9. An MCP having a plurality of chips comprising:

a plurality of inductor pads in each of the chips configured to wirelessly transmit power or signals, wherein

the inductor pads include a first inductor pad formed at one side of a reference inductor pad and configured to generate magnetic flux in the same direction as the reference inductor pad, and a second inductor pad formed at the other side of the reference inductor pad and configured to generate magnetic flux in a different direction from that of the reference inductor pad.

10. An MCP having a plurality of chips comprising:

a plurality of inductor pads, in each of the chips, which are sequentially grouped in pairs, and one pair of inductor pads is configured to generate magnetic flux in a different direction than an adjacent pair of inductor pads.