METHOD OF FORMING A PATTERNED LAYER OF A MATERIAL ON A SUBSTRATE
First Claim
1. A method of forming a patterned layer of a material on a substrate, the method comprising:
- forming a layer of a material on a stamp;
contacting the stamp with a first substrate comprising a pattern of protruding and recessed features to bring a first portion of the layer into conformal contact with the protruding features;
removing the stamp from the first substrate, the first portion of the layer remaining in conformal contact with the protruding features and a second portion of the layer opposite the recessed features being removed with the stamp, thereby forming a patterned layer on the stamp inverse to the pattern on the first substrate.
2 Assignments
0 Petitions
Accused Products
Abstract
A method of forming a patterned layer of a material on a substrate includes forming a layer of the material on a stamp, and contacting the stamp with a first substrate comprising a pattern of protruding and recessed features to bring a first portion of the layer into conformal contact with the protruding features. The stamp is then removed from the first substrate. The first portion of the layer remains in conformal contact with the protruding features, and a second portion of the layer opposite the recessed features is removed with the stamp. Accordingly, a patterned layer is formed on the stamp inverse to the pattern on the first substrate. The method may further include transferring the patterned layer on the stamp to a second substrate.
-
Citations
33 Claims
-
1. A method of forming a patterned layer of a material on a substrate, the method comprising:
-
forming a layer of a material on a stamp; contacting the stamp with a first substrate comprising a pattern of protruding and recessed features to bring a first portion of the layer into conformal contact with the protruding features; removing the stamp from the first substrate, the first portion of the layer remaining in conformal contact with the protruding features and a second portion of the layer opposite the recessed features being removed with the stamp, thereby forming a patterned layer on the stamp inverse to the pattern on the first substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
-
-
29. A method of forming a structure on a substrate, the method comprising:
-
forming a first layer comprising a photosensitive polymer on a stamp; contacting the stamp with a substrate comprising a pattern of protruding and recessed features, thereby bringing a portion of the first layer into conformal contact with the protruding features of the substrate; transferring an entirety of the first layer to the substrate, the stamp being removed from the substrate; and removing material from the first layer, thereby forming a first patterned layer comprising the photosensitive polymer on the pattern of protruding and recessed features. - View Dependent Claims (30, 31, 32, 33)
-
Specification