Electric discharge protection for surface mounted and embedded components

• US 20110211319A1
• Filed: 02/25/2011
• Published: 09/01/2011
• Est. Priority Date: 02/26/2010
• Status: Active Grant

• Current Assignee: Littelfuse Incorporated
• Original Assignee: Littelfuse Incorporated
• Inventors: Graydon, Bhret, Kosowsky, Lex, Fleming, Robert, Vasquez, Daniel
• Granted Patent: US 9,320,135 B2
• Time in Patent Office: Days
• US Class Current: 361/763
• CPC Class Codes: H05K 1/0254 High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079; Arrangements for regulating voltages or for using plural voltages
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0738 Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
• CPC Class Codes: H05K 2203/304 Protecting a component during manufacturing

Abstract

Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.

Claims

1. A printed circuit board, comprising:

at least one conductor;

a voltage switchable dielectric material (VSDM) applied to the at least one conductor; and

an electronic component having at least one lead, wherein the at least one lead is electrically coupled to the VSDM.

2. The printed circuit board of claim 1, wherein the electronic component is an embedded component.

3. The printed circuit board of claim 2, wherein the embedded component includes one or more of a resistor, an inductor, and a capacitor.

4. The printed circuit board of claim 2, wherein the embedded component includes one or more of a diode, a transistor, a semiconductor device, a circuit, a chip, and an integrated circuit.

5. The printed circuit board of claim 1, wherein the electronic component is a surface mounted component.

6. The printed circuit board of claim 5, wherein the surface mounted component includes one or more of a resistor, an inductor, and a capacitor.

7. The printed circuit board of claim 5, wherein the surface mounted component includes one or more of a diode, a transistor, a semiconductor device, a circuit, a chip, and an integrated circuit.

8. The printed circuit board of claim 1, wherein the VSDM is a layer.

9. The printed circuit board of claim 8, wherein the VSDM layer is incorporated within a non-conductive layer.

10. The printed circuit board of claim 8, wherein the VSDM layer is disposed between at least two non-conductive layers.

11. A printed circuit board, comprising:

at least one non-conductive layer;

at least one conductor;

a voltage switchable dielectric material (VSDM) applied to at least one of the non-conductive layers; and

an electronic component having at least one lead, wherein the at least one lead is electrically coupled to the VSDM.

12. The printed circuit board of claim 11, wherein the electronic component is an embedded component.

13. The printed circuit board of claim 12, wherein the embedded component includes one or more of a resistor, an inductor, and a capacitor.

14. The printed circuit board of claim 12, wherein the embedded component includes one or more of a diode, a transistor, a semiconductor device, a circuit, a chip, and an integrated circuit.

15. The printed circuit board of claim 11, wherein the electronic component is a surface mounted component.

16. The printed circuit board of claim 15, wherein the surface mounted component includes one or more of a resistor, an inductor, and a capacitor.

17. The printed circuit board of claim 15, wherein the surface mounted component includes one or more of a diode, a transistor, a semiconductor device, a circuit, a chip, and an integrated circuit.

18. The printed circuit board of claim 11, wherein the VSDM is a layer.

19. The printed circuit board of claim 18, wherein the VSDM layer is incorporated within the at least one non-conductive layer.

20. The printed circuit board of claim 18, wherein the VSDM layer is disposed between at least two non-conductive layers.