LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME

• US 20110211334A1
• Filed: 03/30/2011
• Published: 09/01/2011
• Est. Priority Date: 04/01/2010
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: KIM, Wan Ho
• Granted Patent: US 9,039,216 B2
• Time in Patent Office: Days
• US Class Current: 362/84
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

Disclosed are a light emitting device package and a light unit having the same. The light emitting device package includes a ceramic substrate; a light emitting device on the ceramic substrate; a first light-transmissive resin layer on the ceramic substrate to cover the light emitting device; and a phosphor layer on the first light-transmissive resin layer.

Claims

1. A light emitting device package comprising:

a ceramic substrate;

a semiconductor light emitting device on the ceramic substrate;

a first light-transmissive resin layer on the ceramic substrate to cover the semiconductor light emitting device; and

a phosphor layer on the first light-transmissive resin layer,

wherein the first light-transmissive resin layer has a same width that of the ceramic substrate.

2. The light emitting device package of claim 1, further comprising a second light-transmissive resin layer on the phosphor layer.

3. The light emitting device package of claim 2, wherein the second light-transmissive resin layer includes a lens unit protruding upward of the semiconductor light emitting device.

4. The light emitting device package of claim 2, wherein the first light-transmissive resin layer has a same width that of the phosphor layer.

5. The light emitting device package of claim 2, wherein the second light-transmissive resin layer makes contact with the first light-transmissive resin layer and a top surface of the ceramic substrate.

6. The light emitting device package of claim 1, further comprising:

first and second electrode patterns electrically connected to the semiconductor light emitting device on the ceramic substrate;

third and fourth electrode patterns under the ceramic substrate; and

a plurality of first and second conductive vias to connect the first and second electrode patterns with the third and fourth electrode patterns according to polarity of the first to fourth electrode patterns.

7. The light emitting device package of claim 6, further comprising:

a heat radiation pattern below the ceramic substrate; and

a third conductive via to connect the heat radiation pattern with the first or second electrode pattern.

8. The light emitting device package of claim 7, wherein the semiconductor light emitting device is disposed on the first electrode pattern connected to the heat radiation pattern.

9. The light emitting device package of claim 6, further comprising:

a first heat radiation pattern on the substrate;

a second heat radiation pattern under the substrate; and

a fourth conductive via to connect the first and second heat radiation patterns, wherein the semiconductor light emitting device is disposed on the first heat radiation pattern.

10. A light emitting device package comprising:

a substrate;

a semiconductor light emitting device on the substrate;

a resin layer on the substrate; and

a moisture barrier layer disposed on a lateral surface of the substrate and the resin layer.

11. The light emitting device package of claim 10, wherein the moisture barrier layer is formed of a same material that of the resin layer or the substrate.

12. The light emitting device package of claim 10, wherein the resin layer has a width equal to or less that of the substrate and at least lateral side of the substrate disposed at an outer portion than that of the resin layer.

13. The light emitting device package of claim 10, further comprising:

first and second electrode patterns electrically connected to the semiconductor light emitting device on the substrate;

third and fourth electrode patterns under the substrate; and

a plurality of first and second conductive vias to connect the first and second electrode patterns with the third and fourth electrode patterns according to polarity of the first to fourth electrode patterns;

a heat radiation pattern under the substrate; and

a third conductive via to connect the heat radiation pattern with the first or second electrode pattern.

14. The light emitting device package of claim 13, wherein the substrate is a ceramic substrate and the semiconductor light emitting device is formed on the first electrode pattern connected to the heat radiation pattern.

15. The light emitting device package of claim 10, wherein the moisture barrier layer is formed on a lateral surface of the substrate and a whole lateral surface of the resin layer.

16. The light emitting device package of claim 10, wherein the moisture barrier layer includes at least one of alumina, aluminum nitride, silicon, epoxy and hybrid resin.

17. The light emitting device package of claim 10, wherein the resin layer includes a first light-transmissive resin layer on the ceramic substrate, a phosphor layer on the first light-transmissive resin layer, and a second light-transmissive resin layer having a lens unit on the phosphor layer.

18. The light emitting device package of claim 10, wherein the first light-transmissive resin layer, the phosphor layer, and the second light-transmissive resin layer has a size equal to or larger than that of the substrate.

19. The light emitting device package of claim 14, wherein the substrate has a planar top surface.

20. A light unit comprising:

a light emitting device package including a planar type ceramic substrate, a semiconductor light emitting device on the ceramic substrate, a first light-transmissive resin layer on the ceramic substrate to seal the semiconductor light emitting device, and a phosphor layer on the first light-transmissive resin layer;

a module substrate on which the light emitting device package is arrayed; and

a light guide plate or an optical sheet at one side of the light emitting device package,

wherein the first light-transmissive resin layer has a same width that of the ceramic substrate.