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Apparatus and method for predetermined component placement to a target platform

  • US 20110212549A1
  • Filed: 05/13/2010
  • Published: 09/01/2011
  • Est. Priority Date: 02/11/2005
  • Status: Active Grant
First Claim
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1. A method of aligning electrical contacts of a second electronic circuit or assembly with electrical contacts of a first electronic circuit or assembly, the second electronic circuit or assembly and the first electronic circuit or assembly each being provided with one or more alignment features, the method comprising:

  • placing electrical contacts of the second electronic circuit or assembly in contact or near contact with electrical contacts of the first electronic circuit or assembly; and

    during said contact or near contact, electrically or optically sensing an alignment condition of alignment features of the second electronic circuit or assembly and alignment features of the first electronic circuit or assembly;

    during said sensing, obtaining and storing sensing information; and

    analyzing said sensing information to determine a movement to be caused between the second electronic circuit or assembly and the first electronic circuit or assembly to achieve an improved alignment condition;

    wherein at least one of the first electronic circuit or assembly and the second electronic circuit or assembly comprises a singulated integrated circuit.

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