FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES AND TRACES

• US 20110212555A1
• Filed: 05/12/2011
• Published: 09/01/2011
• Est. Priority Date: 10/03/2006
• Status: Active Grant

• Current Assignee: Roger S. Kerr, Timothy J. Tredwell
• Original Assignee: Roger S. Kerr, Timothy J. Tredwell
• Inventors: Tredwell, Timothy J., Kerr, Roger S.
• Granted Patent: US 8,288,214 B2
• Time in Patent Office: Days
• US Class Current: 438/27
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 29/78603 characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material and has a metallic coating on one surface. A portion of the metallic coating is etched to form a patterned metallic coating. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).

Claims

1. A method of manufacturing an electronic device comprising:

a) providing a substrate that comprises at least one plastic material;

b) forming a pattern on at least one surface of said substrate;

c) embedding a particulate material into the at least one surface of said substrate;

d) applying a planarization material to the surface of the substrate having the embedded particulate material, forming a planarization layer thereby;

e) forming a thin film electronic device on said surface with said particulate material; and

f) forming a patterned trace layer on the surface of the substrate that lies opposite the surface having the embedded particulate material.

2. The method of claim 1 wherein forming a pattern comprises embossing.

3. The method of claim 1 wherein the pattern comprises one or more lens elements.

4. The method of claim 1 wherein the one or more lens elements are spatially aligned with the thin film electronic devices formed on said surface.

5. The method of claim 1 wherein the step of providing the substrate comprises unwinding the substrate from a roll.

6. The method of claim 5 further comprising re-winding the substrate having the electronic device formed thereon onto a roll.

7. The method of claim 1 further comprising coupling the electronic device formed on said surface with a liquid crystal pixel.

8. The method of claim 1 further comprising coupling the electronic device formed on said surface with a light-emitting diode pixel.

9. The method of claim 1 further comprising coupling the electronic device formed on said surface with an organic light-emitting diode pixel.

10. The method of claim 1 further comprising coupling the electronic device formed on said surface with a stimulable phosphor pixel.

11. The method of claim 1 further comprising coupling the electronic device formed on said surface with a sensor pixel.

12. A method of manufacturing an electronic device comprising:

a) providing a substrate that comprises at least one plastic material having a metallic coating on one surface;

b) forming a trace pattern by etching the metallic coating;

c) applying a planarization material to an opposite surface of the substrate, forming a planarization layer thereby;

d) forming a thin film electronic device on said surface with said particulate material; and

e) forming a via connecting the thin-film electronic device with a portion of the trace pattern.