METHOD FOR MANUFACTURING THIN FILM INTEGRATED CIRCUIT, AND ELEMENT SUBSTRATE
First Claim
1. A method for manufacturing a semiconductor device, comprising the steps of:
- forming a separation layer over a first substrate;
forming a first transistor and a second transistor over the separation layer;
forming an insulating film over the first transistor, the second transistor, and the separation layer;
selectively etching the insulating film, and forming a groove between the first transistor and the second transistor to expose the separation layer;
attaching a second substrate having an opening with the insulating film so that the opening is overlapped with the groove; and
separating the first substrate from the first transistor and the second transistor by introducing an etchant into the opening and removing the separation layer,wherein the first transistor and the second transistor are integrated by the second substrate.
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Accused Products
Abstract
Application form of and demand for an IC chip formed with a silicon wafer are expected to increase, and further reduction in cost is required. An object of the invention is to provide a structure of an IC chip and a process capable of producing at a lower cost. In view of the above described object, one feature of the invention is to provide the steps of forming a separation layer over an insulating substrate and forming a thin film integrated circuit having a semiconductor film as an active region over the separation layer, wherein the thin film integrated circuit is not separated. There is less limitation on the shape of a mother substrate in the case of using the insulating substrate, when compared with the case of taking a chip out of a circular silicon wafer. Accordingly, reduction in cost of an IC chip can be achieved.
77 Citations
22 Claims
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1. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a separation layer over a first substrate; forming a first transistor and a second transistor over the separation layer; forming an insulating film over the first transistor, the second transistor, and the separation layer; selectively etching the insulating film, and forming a groove between the first transistor and the second transistor to expose the separation layer; attaching a second substrate having an opening with the insulating film so that the opening is overlapped with the groove; and separating the first substrate from the first transistor and the second transistor by introducing an etchant into the opening and removing the separation layer, wherein the first transistor and the second transistor are integrated by the second substrate. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a separation layer over a substrate; forming a first transistor and a second transistor over the separation layer; forming an insulating film over the first transistor, the second transistor, and the separation layer; forming a wiring over the insulating film; selectively etching the wiring and the insulating film, and forming a groove between the first transistor and the second transistor to expose a part of the separation layer, thereby forming a connection region; and separating the substrate by introducing an etchant into the groove and removing the separation layer, wherein the connection region is the part of the insulating film and the wiring, and wherein the first transistor and the second transistor are integrated by the connection region. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a separation layer over a first substrate; forming a first chip including a first transistor and a second chip including a second transistor over the separation layer; forming an insulating film over the first transistor, the second transistor, and the separation layer; selectively etching the insulating film, and forming a groove between the first chip and the second chip to expose the separation layer; attaching a second substrate having an opening with the insulating film so that the opening is overlapped with the groove; separating the first substrate from the first chip and the second chip by introducing an etchant into the opening and removing the separation layer; and cutting the second substrate to separate the first chip from the second chip, wherein the first transistor and the second transistor are integrated by the second substrate before the step of cutting the second substrate. - View Dependent Claims (14, 15, 16, 17)
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18. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a separation layer over a substrate; forming a first chip including a first transistor and a second chip including a second transistor over the separation layer; forming an insulating film over the first transistor, the second transistor, and the separation layer; forming a wiring over the insulating film; selectively etching the wiring and the insulating film, and forming a groove between the first chip and the second chip to expose a part of the separation layer, thereby forming a connection region; separating the substrate by introducing an etchant into the groove and removing the separation layer; and removing the connection region to separate the first chip from the second chip, wherein the connection region is the part of the insulating film and the wiring, and wherein the first chip and the second chip are integrated by the connection region before the step of removing the connection region. - View Dependent Claims (19, 20, 21, 22)
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Specification