Apparatus and Method for Electrostatic Discharge Protection
First Claim
1. A substrate capable of receiving electrostatic discharge, the substrate comprising:
- an edge surface including at least one plated castellation capable of conducting the electrostatic discharge;
a bottom surface;
a top surface; and
a circuit trace along at least one of the bottom surface and the top surface, the circuit trace electrically connected to the at least one plated castellation.
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Accused Products
Abstract
Embodiments of the invention provide a substrate and a method for constructing a substrate with electrostatic discharge protection. The substrate includes an edge surface with at least one plated castellation capable of conducting electrostatic discharge. The at least one plated castellation is connected to a circuit trace on at least one of the bottom surface and the top surface of the substrate. The method includes punching holes along at least a portion of a perimeter of each of a plurality of substrates in a substrate array, plating the holes with a conductive material, and cutting each of the plurality of substrates along cut lines that bisect at least some of the holes.
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Citations
20 Claims
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1. A substrate capable of receiving electrostatic discharge, the substrate comprising:
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an edge surface including at least one plated castellation capable of conducting the electrostatic discharge; a bottom surface; a top surface; and a circuit trace along at least one of the bottom surface and the top surface, the circuit trace electrically connected to the at least one plated castellation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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- 10. The substrate of claim 9 wherein the top surface provides an area for a finger to be swiped.
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10-1. A method of constructing a substrate for a touch electronics circuit intended for receiving touch or press from a part of a living body, the method comprising:
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providing a surface for receiving the touch or press from the part of the living body; providing a substrate array including a plurality of substrates; punching via holes along at least a portion of a perimeter of each of the plurality of substrates; plating the via holes with a conductive material; and cutting each of the plurality of substrates along cut lines that bisect at least some of the via holes.
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17. A method of constructing a substrate with electrostatic discharge protection, the method comprising:
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providing a substrate array including a plurality of substrates; punching holes along at least a portion of a perimeter of each of the plurality of substrates; plating the holes with a conductive material; cutting each of the plurality of substrates along cut lines that bisect at least some of the holes; and connecting the conductive material to a known potential. - View Dependent Claims (18, 19, 20)
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Specification