SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF
First Claim
1. A semiconductor storage device including;
- a semiconductor substrate;
a selection transistor formed on a main surface of the semiconductor substrate;
an inter-layer insulative film disposed over the selection transistor;
a plug selectively disposed to pass through the inter-layer insulative film and connected electrically with the selection transistor;
a chalcogenide material layer connected to one end of the plug and disposed so as to extend over the inter-layer insulative film;
an upper electrode disposed over the chalcogenide material layer; and
an interfacial layer formed between the chalcogenide material layer and the inter-layer insulative film so as to cover at least one end of the plug and comprising a continuous semiconductor not having a region where the chalcogenide material layer and the inter-layer insulative film are not in direct contact with each other.
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Accused Products
Abstract
Since a chalcogenide material has low adhesion to a silicon oxide film, there is a problem in that it tends to separate from the film during the manufacturing step of a phase change memory. In addition, since the chalcogenide material has to be heated to its melting point or higher during resetting (amorphization) of the phase change memory, there is a problem of requiring extremely large rewriting current. An interfacial layer includes an extremely thin insulator or semiconductor having the function as both an adhesive layer and a high resistance layer (thermal resistance layer) is inserted between chalcogenide material layer/interlayer insulative film and between chalcogenide material layer/plug.
27 Citations
20 Claims
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1. A semiconductor storage device including;
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a semiconductor substrate; a selection transistor formed on a main surface of the semiconductor substrate; an inter-layer insulative film disposed over the selection transistor; a plug selectively disposed to pass through the inter-layer insulative film and connected electrically with the selection transistor; a chalcogenide material layer connected to one end of the plug and disposed so as to extend over the inter-layer insulative film; an upper electrode disposed over the chalcogenide material layer; and an interfacial layer formed between the chalcogenide material layer and the inter-layer insulative film so as to cover at least one end of the plug and comprising a continuous semiconductor not having a region where the chalcogenide material layer and the inter-layer insulative film are not in direct contact with each other. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor storage device comprising;
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a semiconductor substrate; a selection transistor formed on a main surface of the semiconductor substrate; an inter-layer insulative film disposed over the selection transistor; a plug selectively disposed to pass through the inter-layer insulative film and connected electrically with the selection transistor; a chalcogenide material layer connected to one end of the plug and disposed so as to extend over the inter-layer insulative film; an upper electrode disposed over the chalcogenide material layer; an adhesion layer comprising a semiconductor formed between the chalcogenide material layer and the inter-layer insulative film; and an interfacial layer formed between the chalcogenide material layer and the plug and comprising an alloy of a material of the adhesion layer and a material of the plug. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A semiconductor storage device including:
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a plug; a phase change material layer formed on the plug; and an electrode formed on the phase change material layer, wherein the semiconductor storage device stores data according to a phase state of a region of the phase change material layer that is continuous between the plug and the electrode, and further includes a boundary layer formed between the plug and the phase change material layer and comprised of a semiconductor film having such a thickness that a tunnel current flows. - View Dependent Claims (14, 15, 16, 17)
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18. A semiconductor storage device including:
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a plug; a phase change material layer formed on the plug; and an electrode formed on the phase change material layer, wherein the semiconductor storage device stores data according to a phase state of a region of the phase change material layer that is continuous between the plug and the electrode, and further includes a boundary layer formed between the plug and the phase change material layer and comprised of an alloy of a semiconductor material and a material applying to the plug. - View Dependent Claims (19, 20)
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Specification