Multichip semiconductor device, chip therefor and method of formation thereof
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Abstract
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug.
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Citations
71 Claims
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1-61. -61. (canceled)
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62. A multichip semiconductor device including a plurality of chips stacked on each other, each of the chips having a semiconductor substrate on which circuit components are formed, wherein
two adjacent chips included in the plurality of chips are electrically connected to each other via a connecting substrate provided between the two adjacent chips, a through hole is formed in the semiconductor substrate, and a conductive plug formed in the through hole is connected to the connecting substrate.
Specification