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SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

  • US 20110215478A1
  • Filed: 03/03/2011
  • Published: 09/08/2011
  • Est. Priority Date: 03/04/2010
  • Status: Abandoned Application
First Claim
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1. A wiring substrate containing a semiconductor element, the wiring substrate comprising:

  • a supporting substrate;

    a semiconductor element provided on the supporting substrate;

    a peripheral insulating layer provided on the supporting substrate and covering at least an outer circumferential side surface of the semiconductor element; and

    upper surface-side wiring provided on the upper surface side of the wiring substrate,the semiconductor element comprising;

    a semiconductor substrate;

    a first wiring-structure layer comprising first wiring and a first insulating layer alternately formed on the semiconductor substrate; and

    a second wiring-structure layer comprising second wiring and a second insulating layer alternately formed on the first wiring-structure layer,wherein the upper surface-side wiring comprises fan-out wiring led out from immediately above the semiconductor element to a peripheral region external to an outer edge of the semiconductor element, the fan-out wiring being electrically connected to the first wiring through the second wiring;

    the thickness of the second wiring is greater than the thickness of the first wiring but less than the thickness of the upper surface-side wiring; and

    the second insulating layer is formed of a resin material and greater in thickness than the first insulating layer.

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