Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like

• US 20110215484A1
• Filed: 03/05/2010
• Published: 09/08/2011
• Est. Priority Date: 03/05/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Upek, Inc. (Apple Inc.)
• Inventors: Kramer, Alan, Gozzini, Giovanni, Bond, Robert
• Granted Patent: US 8,378,508 B2
• Time in Patent Office: Days
• US Class Current: 257/787
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H10N 39/00 Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Abstract

A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.

Claims

1. A fingerprint sensor device, comprising:

a substrate having a first side and a second side;

a die having formed therein fingerprint sensing circuitry, said die secured to a die-receiving region of said first side of said substrate;

a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region; and

an encapsulation structure integrally encasing at least a portion of said die and a portion of said first conductive bezel.

2. The fingerprint sensor of claim 1, wherein said encapsulation structure only partially encases said first conductive bezel such that at least a top surface of said first conductive bezel is not encased and is thereby exposed for physical contact or application of one or more layers thereover.

3. The fingerprint sensor of claim 2, wherein said die has formed on a surface thereof a sensor array for sensing a fingerprint pattern of a user, and wherein said encapsulation structure partially encases said die such that said sensor array is uncovered and exposed for physical contact.

4. The fingerprint sensor of claim 3, wherein said sensor array forms a component of a fingerprint strip sensor.

5. The fingerprint sensor of claim 3, wherein said sensor array forms a component of a fingerprint area sensor.

6. The fingerprint sensor of claim 1, wherein said encapsulation structure fully encases said die and first conductive bezel such that a top surface of each of said die and said first conductive bezel are encased by a portion of said encapsulation structure which is relatively much thinner that the remainder of said encapsulation structure.

7. The fingerprint sensor of claim 6, wherein said die has formed on a surface thereof a sensor array for capacitively sensing a fingerprint pattern of a user, and wherein said encapsulation structure encases said die such that said sensor array is thinly encased by said encapsulation structure such that the thickness of said encapsulation structure over said sensor array does not reduce the sensitivity of the sensor array in a manner that substantially prevents the possibility of said sensor array to capacitively sense a fingerprint of a finger in physical contact with said encapsulation structure over said sensor array.

8. The fingerprint sensor of claim 7, wherein said sensor array forms a component of a fingerprint strip sensor.

9. The fingerprint sensor of claim 7, wherein said sensor array forms a component of a fingerprint area sensor.

10. The fingerprint sensor of claim 1, further comprising:

a second conductive bezel secured to a second bezel-receiving region of said first side of said substrate;

wherein said encapsulation structure further substantially encloses said second conductive bezel integrally with said die and said first conductive bezel.

11. The fingerprint sensor of claim 10, wherein said first conductive bezel and said second conductive bezel form portions of a bezel frame, and further wherein said bezel frame is physically coupled to said substrate.

12. The fingerprint sensor of claim 11, wherein said bezel frame is electrically coupled to said die by way of said substrate.

13. The fingerprint sensor of claim 1, wherein said first conductive bezel is electrically coupled to said die by way of said substrate.

14. The fingerprint sensor of claim 1, wherein said bezel defines an opening in which said die is located such that said dies is surrounded by said bezel.

15. The fingerprint sensor of claim 1 in which said die has a top surface in a first plane, and said bezel has a top surface also in said first plane.

16. The fingerprint sensor of claim 1, wherein said die has a top surface substantially in a die plane and said bezel has a top surface such that said bezel top surface is substantially at, but not past, said die plane.

17. The fingerprint sensor of claim 1, wherein said first side of said substrate is in a first plane, said die has a top surface in a second plane, and said bezel has a top surface, and further in which said die and bezel are positioned relative to one another such that the distance between said first plane and said bezel top surface is greater than the distance between said first plane and said second plane.

18. The fingerprint sensor of claim 17, wherein said bezel top surface is convex.

19. The fingerprint sensor of claim 1, wherein said first conductive bezel has an arch-shaped side profile having a top surface and two attachment feet having attachment portions, said top surface and said attachment feet defining an interior region therebetween, and further wherein said encapsulation structure includes a portion thereof disposed in and substantially filling said interior region.

20. A fingerprint sensor assembly comprising:

a substrate having a first side and a second side;

a die having formed thereon a fingerprint sensing array, said die secured to a die-receiving region of said first side of said substrate;

a first conductive bezel secured to a first bezel-receiving region of said first side of said substrate proximate said die-receiving region;

a second conductive bezel secured to a second bezel-receiving region of said first side of said substrate proximate said die-receiving region, such that said die receiving region is between said first and second bezel-receiving regions; and

an encapsulation structure integrally encapsulating said die, said first conductive bezel, and said second conductive bezel, said encapsulation structure substantially encasing said die and said first and second conductive bezels such that only said fingerprint sensing array and a portion of a top surface of each of said first conductive bezel and said second conductive bezel are not encased by said encapsulation structure and are exposed for physical contact.

21. The fingerprint sensor of claim 20, wherein said first conductive bezel and said second conductive bezel are each electrically coupled to said die by way of said substrate.