Insert Molded Device Housings for Portable Electronic Devices

• US 20110215685A1
• Filed: 09/30/2010
• Published: 09/08/2011
• Est. Priority Date: 03/06/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Moolsintong, Pinida Jan, Jarvis, Daniel W., Tan, Tang Tew, Zadesky, Stephen Paul
• Granted Patent: US 8,607,444 B2
• Time in Patent Office: Days
• US Class Current: 312/223.1
• CPC Class Codes: B29K 2995/0026 Transparent
• CPC Class Codes: B29L 2031/3437 Cellular phones
• CPC Class Codes: B32B 37/16 with all layers existing as coherent layers before laminating
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: H04M 1/0266 for a display module assembly
• CPC Class Codes: H04M 1/0283 for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/02 Details
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49158 with molding of insulated base

Abstract

Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

Claims

1. A method for assembling a device housing of an electronic device, said method comprising:

providing an outer housing member for a first portion of the device housing;

providing a thin film for an internal structural member of the device housing;

securing together the outer housing member and the thin film; and

molding an outer molded member for a second portion of the device housing against a surface of the thin film and against at least a surface of the outer housing member.

2. A method as recited in claim 1,

wherein the outer housing member is a glass outer housing member, and

wherein the thickness of the outer housing member is about 0.4-2.5 mm.

3. A method as recited in claim 1, wherein the thickness of the outer housing member is not more than about 1 mm.

4. A method as recited in claim 1, wherein the thickness of the thin film is about 0.1-0.5 mm.

5. A method as recited in claim 1, wherein the thin film is formed from a clear polymer.

6. A method as recited in claim 1, wherein the securing comprises:

providing a layer of adhesive on a surface of the outer housing member or on a surface of the thin film; and

placing at least the portion of the thin film against the portion of the outer housing member, with the layer of adhesive therebetween serving to secure together the outer housing member and the thin film.

7. A method as recited in claim 6, wherein the layer of adhesive is a clear adhesive.

8. A method as recited in claim 1, wherein the electronic device is a handheld electronic device.

9. A method as recited in claim 1,

wherein the outer housing member includes at least a top surface, and a bottom surface,

wherein the thin film includes at least a top surface and a bottom surface, and

wherein the securing comprises:

securing at least a portion of the bottom surface of the outer housing member to at least a portion of the top surface of the thin film.

10. A method as recited in claim 9, wherein the securing comprises depositing a layer of adhesive on the bottom surface of the portion of the outer housing member or the portion of the top surface of the thin film.

11. A method as recite in claim 1, wherein the method comprises:

depositing a cosmetic layer on at least a portion of the thin file.

12. A method as recite in claim 1, wherein the method comprises:

printing a layer of ink on at least a portion of the thin film.

13. A method as recited in claim 1, wherein the outer molded member is optically clear.

14. A method as recited in claim 1, wherein the thin film at least partially secures the outer housing member to the outer molded member.

15. An electronic device having a device housing including an outer housing member, the device housing being formed by the method of:

providing the outer housing member for a first portion of the device housing;

providing a thin film substrate for an internal structural member of the device housing;

securing together the outer housing member and the thin film substrate; and

molding an outer molded member for a second portion of the device housing against a surface of the thin film substrate and against at least a surface of the outer housing member.

16. An electronic device as recited in claim 15, wherein the outer housing member is a glass outer housing member.

17. An electronic device enclosure, comprising:

a thin substrate;

a glass cover window for a top surface for the electronic device enclosure, the glass cover window being secured to the thin substrate; and

at least one molded side member for a side surface for the electronic device enclosure, the at least one molded side member being molded adjacent to at least a portion of the thin substrate and adjacent to at least one side surface of the glass cover window.

18. An electronic device enclosure as recited in claim 17, wherein the thickness of the glass cover window is about 0.4-2.5 mm.

19. An electronic device enclosure as recited in claim 18, wherein the thickness of the thin substrate is about 0.1-0.5 mm.

20. An electronic device enclosure as recited in claim 17, wherein the electronic device enclosure further comprises:

an internal structure provided internal to the electronic device enclosure, the internal structure being secured to an inner surface of the at least one molded side member.

21. An electronic device enclosure as recited in claim 17, wherein the electronic device enclosure comprises:

a LCD module provided internal to the electronic device enclosure and adjacent a bottom surface of the thin film.

22. An electronic device enclosure as recited in claim 17, wherein the width of the LCD module can be substantially the same as the width of the outer housing member.

23. An electronic device enclosure as recited in claim 17, wherein the outer housing member can be secured to the device housing without requiring an internal support flange that blocks and thus renders unusable significant peripheral portions of a bottom surface of the outer housing member.

24. An electronic device enclosure as recited in claim 17, wherein the outer housing member comprises glass, and wherein the at least one molded side member comprises optically clear plastic.

25. An electronic device as recited in claim 17, wherein the thin substrate is formed of a polymer.

26. An electronic device as recited in claim 17, wherein the thin substrate is formed of a metal having an opening adjacent a central region of the glass cover window.

27. A method for assembling a device housing of an electronic device, said method comprising:

providing an outer housing member for a first portion of the device housing;

providing a thin metal substrate for an internal structural member of the device housing, the thin metal substrate having a central opening, the central opening corresponding to a significant portion of the outer housing member;

securing together the outer housing member and the thin metal substrate, the central opening in the thin metal substrate being aligned with the outer housing member; and

molding an outer molded member for a second portion of the device housing against a surface of the thin metal substrate and against at least a surface of the outer housing member.

28. A method as recited in claim 27, wherein the outer housing member is a glass outer housing member.

29. A method as recited in claim 27, wherein the thickness of the outer housing member is not more than about 1 mm.

30. A method as recited in claim 27, wherein the thickness of the thin metal substrate is about 0.1-0.5 mm.