LED-BASED LIGHTING FIXTURES FOR SURFACE ILLUMINATION WITH IMPROVED HEAT DISSIPATION AND MANUFACTURABILITY

• US 20110216538A1
• Filed: 05/16/2011
• Published: 09/08/2011
• Est. Priority Date: 05/07/2007
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: LOGAN, Derek, PIEPGRAS, Colin
• Granted Patent: US 8,434,897 B2
• Time in Patent Office: Days
• US Class Current: 362/244
• CPC Class Codes: F21S 4/28 rigid, e.g. LED bars
• CPC Class Codes: F21S 8/036 by means of a rigid support, e.g. bracket or arm
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 15/013 the housing being an extrusion
• CPC Class Codes: F21V 15/04 Resilient mountings, e.g. shock absorbers shock absorbing devices of vehicle headlamp housings B60Q1/0491; in general F16F15/04
• CPC Class Codes: F21V 17/12 by screwing
• CPC Class Codes: F21V 21/005 for several lighting devices in an end-to-end arrangement, i.e. light tracks
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 5/00 Refractors for light sources characterised by cooling arrangements F21V29/504
• CPC Class Codes: F21V 5/002 using microoptical elements for redirecting or diffusing light
• CPC Class Codes: F21V 7/0091 using total internal reflection
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05B 45/355 Power factor correction [PFC]; Reactive power compensation
• CPC Class Codes: H05B 45/3725 Switched mode power supply [SMPS]
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

LED-based lighting apparatus and assembly methods in which mechanical and/or thermal coupling between respective components is accomplished via a transfer of force from one component to another. In one example, a multiple-LED assembly is disposed in thermal communication with a heat sink that forms part of a housing. A primary optical element situated within a pressure-transfer member is disposed above and optically aligned with each LED. A shared secondary optical facility forming another part of the housing is disposed above and compressively coupled to the pressure-transfer members. A force exerted by the second optical facility is transferred via the pressure-transfer members so as to press the LED assembly toward the heat sink, thereby facilitating heat transfer. In one aspect, the LED assembly is secured in the housing without the need for adhesives. In another aspect, the secondary optical facility does not directly exert pressure onto any primary optical element, thereby reducing optical misalignment.

Claims

1-28. -28. (canceled)

29. A lighting apparatus, comprising:

a heat sink having a first surface;

an LED printed circuit board having second and third opposing surfaces, wherein the second surface is disposed on the first surface of the heat sink and wherein the third surface has at least one LED light source disposed thereon;

an integrated lens-housing member having a transparent upper wall disposed to receive light emitted by the at least one LED light source;

a pressure-transfer member having a support structure extending generally in the direction from the LED printed circuit board to the transparent upper wall of the integrated lens-housing member and defining an aperture,

a compliant member interposed between the integrated lens-housing member and the support structure of the pressure-transfer member, and

a pressure-transfer surface connected to the support structure and disposed on the third surface of said LED printed circuit board proximate to the LED light source; and

an optic member disposed in the aperture defined by the support structure of the pressure-transfer member,

wherein the integrated lens-housing member is compressively coupled to the pressure-transfer member, such that a force exerted by the integrated lens-housing member is transferred via the pressure-transfer member to the pressure-transfer surface so as to press the LED printed circuit board toward the first surface of the heat sink to facilitate heat transfer from the LED printed circuit board to the heat sink.

30. The lighting apparatus of claim 29, wherein the integrated lens-housing member has opposing side walls contiguous with the transparent upper wall, and wherein the opposing side walls are connected to the heat sink so as to generate the force exerted by the integrated lens-housing member onto the pressure-transfer member.

31. The lighting apparatus of claim 30, wherein the integrated lens-housing member further comprises a first over-molded end wall and a second over-molded end wall each contiguous with the opposing side walls and the transparent upper wall, and wherein the first over-molded end wall and the second over-molded end wall oppose each other.

32. The lighting apparatus of claim 31, further comprising a first lighting apparatus and a second lighting apparatus arranged linearly relative to each other, wherein the first lighting apparatus includes a third over-molded end wall, wherein the second lighting apparatus includes a fourth over-molded end wall, and wherein the third over-molded end wall abuts the fourth over-molded end wall.

33. The lighting apparatus of claim 32, wherein a distance between the third over-molded end wall and the fourth over-molded end wall is less than about 3 millimeters, thereby defining a gap between the first lighting apparatus and the second lighting apparatus.

34. The lighting apparatus of claim 29, wherein the compliant member is selected for its compression recovery and is disposed on a top rim of the pressure-transfer member and extends generally in a direction of the transparent upper wall to provide a fourth surface to engage the transparent upper wall when the integrated lens-housing member is compressively coupled to the pressure-transfer member.

35. The lighting apparatus of claim 29, wherein

the integrated lens-housing member is connected to the heat sink by a non-adhesive connector, and

the transparent upper wall of the integrated lens-housing member has an inner surface having at least one connecting pin.

36. The lighting apparatus of claim 35, further comprising a light diffusion layer disposed on the inner surface of the transparent upper wall, the connecting pin being configured to hold the light diffusion layer against the inner surface of the transparent upper wall.

37. The lighting apparatus of claim 29, wherein the integrated lens-housing member is not compressively coupled to the optic member.

38. The lighting apparatus of claim 29, wherein the compliant member comprises a thermoplastic elastomer.

39. The lighting apparatus of claim 29, further comprising a thermal interface layer interposed between the LED printed circuit board and the first surface of the heat sink.

40. The lighting apparatus of claim 39, wherein the thermal interface layer comprises graphite.

41. The lighting apparatus of claim 29, wherein the integrated lens-housing member further has opposing end walls contiguous with the transparent upper wall.

42. The lighting apparatus of claim 29, wherein the integrated lens-housing member comprises a polycarbonate.

43. The lighting apparatus of claim 29, wherein a shortest distance between the pressure-transfer surface and the LED light source is less than about 2 millimeters, and a minimum thickness of the integrated lens-housing member is about 3 millimeters.

44. The lighting apparatus of claim 29, wherein the pressure-transfer member is opaque.

45. The lighting apparatus of claim 29, wherein the optic member comprises a total internal reflection optic.

46. An LED-based lighting apparatus, comprising:

a heat sink;

an LED assembly including a plurality of LEDs disposed on a substrate;

a plurality of optical units, each optical unit of the plurality of optical units comprising a pressure-transfer member, respectively, and a primary optical element situated within the pressure-transfer member, each optical unit disposed above a different LED of the plurality of LEDs; and

a secondary optical facility disposed above and compressively coupled to the plurality of optical units, such that a force exerted by the secondary optical facility is transferred via the pressure-transfer members so as to press the LED assembly toward the heat sink to facilitate heat transfer from the LED assembly to the heat sink,

wherein the pressure-transfer member of each of the plurality of optical units is designed to apply a force upon the LED assembly about equal to a force applied by pressure-transfer members of others of the plurality of optical units upon the LED assembly.

47. The apparatus of claim 46, wherein:

the heat sink forms a first portion of a housing for the LED assembly; and

the secondary optical facility forms a second portion of a housing for the LED assembly.

48. The apparatus of claim 47, wherein the LED assembly is secured in the housing without an adhesive.

49. The apparatus of claim 47, wherein the secondary optical facility does not directly exert the force onto any primary optical element.