MICROELECTRONIC WORKPIECE PROCESSING SYSTEMS AND ASSOCIATED METHODS OF COLOR CORRECTION
First Claim
Patent Images
1. A method for producing a light emitting diode (LED), comprising:
- forming an (LED) on a substrate;
measuring a base emission characteristic of the formed LED;
selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED is closer to white light than the reference emission characteristic; and
introducing the selected phosphor onto the LED.
8 Assignments
0 Petitions
Accused Products
Abstract
Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
-
Citations
25 Claims
-
1. A method for producing a light emitting diode (LED), comprising:
-
forming an (LED) on a substrate; measuring a base emission characteristic of the formed LED; selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED is closer to white light than the reference emission characteristic; and introducing the selected phosphor onto the LED. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method of color correction of light emitting diodes (LEDs), comprising:
-
measuring a base emission characteristic of individual LEDs on a substrate; developing an emission map of the LEDs on the substrate based on the measured base emission characteristics; for the individual LEDs, determining at least one of a composition and a concentration of a converter material based on the emission map of the LEDs; and introducing the selected phosphor onto the individual LEDs on the substrate. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
-
-
18. A system for processing a semiconductor substrate, comprising:
-
a substrate support configured to individually carry a microelectronic workpiece containing a plurality of light emitting diodes (LEDs); a container holding a phosphor; an injector operatively coupled to the container, the injector being configured to introduce a volume of the phosphor onto the individual LEDs of the microelectronic workpiece; and a controller operatively coupled to the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising; receiving a base emission characteristic of the individual LEDs of the microelectronic workpiece; adjusting a characteristic of the phosphor based on the received base emission characteristic of the individual LEDs; and introducing the phosphor with the adjusted characteristic onto the individual LEDs. - View Dependent Claims (19, 20, 21, 22)
-
-
23. A computer-readable medium containing a data structure, the data structure including:
-
a base emission wavelength; a number of phosphors corresponding to the base emission wavelength; and a ratio of the number of phosphors. - View Dependent Claims (24, 25)
-
Specification