Radio Frequency (RF) Antenna Containing Element and Methods of Making the Same

• US 20110220276A1
• Filed: 05/23/2011
• Published: 09/15/2011
• Est. Priority Date: 01/24/2006
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: DIMALANTA, Eric, COLEMAN, James P., AKHAVE, Jay
• Granted Patent: US 10,186,765 B2
• Time in Patent Office: Days
• US Class Current: 156/247
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 2203/0191 Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/1994 Means for delaminating from release surface
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A radio frequency (RF) antenna containing element is provided. The RF antenna containing element includes a reinforced metal foil laminate antenna bonded to a carrier layer. The reinforced metal foil laminate antenna includes a metal foil layer bonded to a reinforcement layer. The reinforcement layer can mitigate tearing of the metal foil layer during formation of the antenna.

Claims

6-1. The method of claim 6, including a further step of stripping off a matrix after the step of die-cutting.

17. A method of forming a radio frequency (RF) antenna containing element, the method comprising:

providing a metal foil laminate having a metal foil layer bonded to a reinforcement layer;

providing a carrier layer;

patterning an antenna adhesive pattern to one of the reinforcement layer and carrier layer laminating the carrier layer and the reinforcement layer;

die-cutting an antenna pattern with a laser die cutter, wherein the antenna pattern is in registration with the antenna adhesive pattern through the metal foil laminate to the carrier layer; and

removing an undesired matrix portion of the reinforced metal foil laminate to provide a metal foil laminate antenna disposed on the carrier layer.