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METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

  • US 20110221075A1
  • Filed: 10/30/2009
  • Published: 09/15/2011
  • Est. Priority Date: 11/06/2008
  • Status: Active Grant
First Claim
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1. A method of manufacturing an electronic device comprising a first electronic component having a first terminal and a second electronic component having a second terminal, wherein said first electric component is electrically connected to said second electronic component by connecting said first terminal to said second terminal with solder, the method comprising:

  • providing a resin layer having a flux action between said first terminal and said second terminal to obtain a laminate including said first electronic component, said second electronic component, and said resin layer, wherein a solder is provided on said first terminal or said second terminal;

    soldering said first terminal and said second terminal; and

    curing said resin layer while pressing said laminate with a pressurized fluid.

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