Power Converter and In-Car Electrical System

• US 20110221268A1
• Filed: 10/22/2009
• Published: 09/15/2011
• Est. Priority Date: 10/23/2008
• Status: Abandoned Application

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Kanazawa, Takuro, Mishima, Akira, Ochi, Kentaro
• Application Number:
  US13/125,514
• Publication Number:
  US 20110221268A1
• Time in Patent Office: Days
• US Class Current: 307/10.1
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors metal strips H05K2201/1028
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

Downsizing, cost reduction, and a low inductance of an input/output circuit are to be achieved with a power converter in which a multilayer board having a power semiconductor module 500 and busbars 11, 12 is modularized. The positive busbar 11 and the negative busbar 12 for feeding main circuit current are provided on a surface of the multilayer board 100 on which a control device 10a is mounted. The positive busbar 11 and the negative busbar 12 are formed to be thicker that the metal layer wiring in each layer of the multilayer board 100. The positive busbar 11 is electrically connected to the 2nth layer wiring (n represents a positive integer) from the positive surface wiring of the multilayer board 100, and the negative busbar 12 to the 2n+1th layer wiring opposite to the 2nth layer wiring of the multilayer board 100, through via holes. As a result, current flows into the power semiconductor module 500 in opposite directions through the 2nth layer wiring and the 2n+1th layer wiring. Thus the inductance of the main circuit is reduced, and downsizing and cost reduction of the high-output power converter energized by a large current can be achieved.

Claims

1-11. -11. (canceled)

12. A power converter, comprising:

a power semiconductor module on which a power semiconductor device is mounted;

a control device for controlling the power semiconductor module;

a multilayer board for mounting the control device; and

a positive busbar and a negative busbar for inputting/outputting electric power to and from the power semiconductor module,

wherein the positive busbar and the negative busbar are mounted on one side of the multilayer board;

wherein the positive busbar is connected to a positive main circuit terminal of the power semiconductor module and a positive surface wiring on a surface mounted on the multilayer board, and the positive surface wiring is connected to a 2nth, n representing positive integer, layer of wiring layers of the multilayer board through a first via hole or a first through-hole;

wherein the negative busbar is connected to a negative main circuit terminal of the power semiconductor module and a negative surface wiring on a surface mounted on the multilayer board, and the negative surface wiring is connected to a 2n+1th layer facing the 2nth layer of the multilayer board through a second via hole or a second through-hole;

wherein the positive main circuit terminal of the power semiconductor module and the positive busbar are electrically connected by a first fixing member; and

wherein the negative main circuit terminal of the power semiconductor module and the negative busbar are electrically connected by a second fixing member.

14. The power converter according to claim 12, further comprising a capacitor and an inductor,

wherein the capacitor is connected between the positive busbar and the negative busbar in parallel, and the inductor is connected to the positive busbar or the negative busbar in series.

16. The power converter according to claim 12,

wherein both the 2nth layer wiring and the 2n+1th layer wiring of the multilayer board, or both a surface wiring formed on a surface of the multilayer board and an inner layer wiring formed on an inner layer of the multilayer board are formed by a solid pattern that is a wiring formed in a wide area.

18. The power converter according to claim 12,

wherein thicknesses of the positive busbar and the negative busbar are formed to be thicker than a thickness of a wiring formed on each layer of the multilayer board.

24. The power converter according to claim 12,

wherein the power converter is housed in a metal box.

25. An in-car electrical system using the power converter according to claim 12,

wherein a direct current power supplied to the positive main circuit terminal and the negative main circuit terminal of the power semiconductor module is converted into an alternate current power, and the alternate current power is supplied to a motor from an alternate main circuit terminal.

13. A power converter, comprising:

a power semiconductor module on which a power semiconductor device is mounted;

a control device for controlling the power semiconductor module;

a multilayer board for mounting the control device; and

a positive busbar and a negative busbar for inputting/outputting electric power to and from the power semiconductor module,

wherein the positive busbar is mounted on one side of the multilayer board and the negative busbar is mounted on the other side of the multilayer board, the positive busbar and the negative busbar facing each other;

wherein the positive busbar is connected to a positive main circuit terminal of the power semiconductor module and a positive surface wiring on a surface mounted on the multilayer board, and the positive surface wiring is connected to a 2nth, n representing positive integer, layer of wiring layers of the multilayer board through a first via hole or a first through-hole;

wherein the negative busbar is connected to a negative main circuit terminal of the power semiconductor module and a negative surface wiring on a surface mounted on the multilayer board, and the negative surface wiring is connected to a 2n+1th layer facing the 2nth layer of the multilayer board through a second via hole or a second through-hole;

wherein the positive main circuit terminal of the power semiconductor module and the positive busbar are electrically connected by a first fixing member; and

wherein the negative main circuit terminal of the power semiconductor module and the negative busbar are electrically connected by a second fixing member.

15. The power converter according to claim 13, further comprising a capacitor and an inductor,

wherein the capacitor is connected between the positive busbar and the negative busbar in parallel, and the inductor is connected to the positive busbar or the negative busbar in series.

17. The power converter according to claim 13,

wherein both the 2nth layer wiring and the 2n+1th layer wiring of the multilayer board, or both a surface wiring formed on a surface of the multilayer board and an inner layer wiring formed on an inner layer of the multilayer board are formed by a solid pattern that is a wiring formed in a wide area.

19. The power converter according to claim 13,

wherein thicknesses of the positive busbar and the negative busbar are formed to be thicker than a thickness of a wiring formed on each layer of the multilayer board.

20. A power converter, comprising:

a power semiconductor module on which a power semiconductor device is mounted;

a control device for controlling the power semiconductor module;

a multilayer board for mounting the control device; and

a positive busbar and a negative busbar for inputting/outputting electric power to and from the power semiconductor module,

wherein the positive busbar and the negative busbar are mounted on one side of the multilayer board, or the positive busbar is mounted on one side of the multilayer board and the negative busbar is mounted on the other side of the multilayer board, the positive busbar and the negative busbar facing each other;

wherein the positive busbar is connected to a positive main circuit terminal of the power semiconductor module and a positive surface wiring on a surface mounted on the multilayer board, and the positive surface wiring is connected to an even number layer or an odd number layer of wiring layers of the multilayer board through a first via hole or a first through-hole;

wherein the negative busbar is connected to a negative main circuit terminal of the power semiconductor module and a negative surface wiring on a surface mounted on the multilayer board, and the negative surface wiring is connected to the even number layer or the odd number layer which is not connected to the positive surface wiring through a second via hole or a second through-hole;

wherein the positive main circuit terminal of the power semiconductor module and the positive busbar are electrically connected by a first fixing member; and

wherein the negative main circuit terminal of the power semiconductor module and the negative busbar are electrically connected by a second fixing member.

21. The power converter according to claim 20, further comprising a capacitor and an inductor,

wherein the capacitor is connected between the positive busbar and the negative busbar in parallel, and the inductor is connected to the positive busbar or the negative busbar in series.

22. The power converter according to claim 20,

wherein both the positive surface wiring as well as the negative surface wiring formed on a surface of the multilayer board and an inner layer wiring formed on an inner layer of the multilayer board, or only the inner layer wiring is formed by a solid pattern that is a wiring formed in a wide area.

23. The power converter according to claim 20,

wherein thicknesses of the positive busbar and the negative busbar are formed to be thicker than a thickness of a wiring formed on each layer of the multilayer board.