ELECTRONIC DEVICE CASE, MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNICATIONS TERMINAL
First Claim
Patent Images
1. An electronic device case comprising:
- a radiator including an antenna pattern portion transmitting or receiving a signal, and a connection terminal portion transmitting the signal to or receiving the signal from a circuit board of an electronic device; and
an electronic device case frame manufactured by subjecting the radiator to injection-molding, supporting the radiator and forming an exterior of the electronic device,wherein the antenna pattern portion includes an exposed portion exposed on the outermost edge of the electronic device case frame.
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Accused Products
Abstract
Provided is an electronic device case. The electronic device case includes a radiator including an antenna pattern portion transmitting or receiving a signal, and a connection terminal portion transmitting the signal to or receiving the signal from a circuit board of an electronic device, and an electronic device case frame manufactured by subjecting the radiator to injection-molding, supporting the radiator and forming an exterior of the electronic device. The antenna pattern portion includes an exposed portion exposed on the outermost edge of the electronic device case frame.
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Citations
20 Claims
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1. An electronic device case comprising:
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a radiator including an antenna pattern portion transmitting or receiving a signal, and a connection terminal portion transmitting the signal to or receiving the signal from a circuit board of an electronic device; and an electronic device case frame manufactured by subjecting the radiator to injection-molding, supporting the radiator and forming an exterior of the electronic device, wherein the antenna pattern portion includes an exposed portion exposed on the outermost edge of the electronic device case frame. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A mobile communications terminal comprising:
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an electronic device case including an electronic device case frame manufactured by subjecting a radiator including an antenna pattern portion and a connection terminal portion to injection-molding, wherein the antenna pattern portion includes an exposed portion exposed on the outermost edge of the electronic device case frame; and a circuit board connected to the connection terminal portion and receiving a signal from or transmitting a signal to the radiator. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A mold for manufacturing an electronic device case, the mold comprising:
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an upper mold and a lower mold receiving a radiator including an antenna pattern portion receiving and transmitting a signal, a connection terminal portion contacting a circuit board of an electronic device, and a connection portion allowing the antenna pattern portion and the connection terminal portion to be arranged in difference planes; and a resin material injection portion formed in the upper mold, the lower mold or the upper and lower molds so that, when the upper and lower molds are joined, a resin material is injected into an internal space between the upper and lower molds through the resin material injection portion and is applied to the radiator to thereby form an electronic device case, wherein the upper mold comes into contact with the radiator so that the antenna pattern portion is exposed on the outermost edge of the electronic device case, and the electronic device case including the radiator is formed in the internal space. - View Dependent Claims (18, 19, 20)
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Specification