OPTICAL TRANSMISSION MODULE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING OPTICAL TRANSMISSION MODULE

• US 20110222815A1
• Filed: 02/17/2011
• Published: 09/15/2011
• Est. Priority Date: 03/15/2010
• Status: Active Grant

• Current Assignee: Omron Corporation
• Original Assignee: Omron Corporation
• Inventors: Yamamoto, Ryo, Yasuda, Naru, Hosokawa, Hayami, Hamana, Kentaro
• Granted Patent: US 8,428,402 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4279 Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

This invention provides an optical transmission module that is of low cost and that can be mounted even in a narrow space. An optical transmission module of the present invention includes a light reception processing section for converting an optical signal transmitted by an optical wiring to an electric signal, a reception side substrate part including an electric wiring for transmitting the electric signal, and a reception side connector section for providing the electric signal to the light reception processing section and the reception side substrate part. The light reception processing section and the reception side connector section are mounted on a same substrate surface of the reception side substrate part, and the reception side substrate part includes a bending portion bent so that the substrate surfaces oppose each other at the back in the normal direction.

Claims

1. An optical transmission module comprising:

an optical module section comprising at least one of a reception module for converting an optical signal transmitted by an optical wiring to an electric signal or a transmission module section for converting the electric signal to the optical single and transmitting the optical signal through the optical wiring;

a circuit substrate comprising an electric wiring for transmitting the electric signal; and

a connecting section comprising an external connection terminal for providing the electric signal to the optical module section and the circuit substrate,

wherein the optical module section and the connecting section being mounted on a same substrate surface of the circuit substrate, and

wherein the circuit substrate further comprises a bending portion bent so that the substrate surfaces oppose each other at the back in a normal direction.

2. The optical transmission module according to claim 1,

wherein the bending portion is arranged between the optical module section and the connecting section, and

wherein the optical module section and the connecting section are arranged in a normal direction of the circuit substrate due to the bend at the bending portion.

3. The optical transmission module according to claim 2, wherein a plate-shaped reinforcement section for reducing an electrical coupling between the optical module section and the connecting section is arranged in a gap portion formed by the back surfaces of the substrate surfaces.

4. The optical transmission module according to claim 3, wherein the reinforcement section has a stacked structure stacked in the normal direction, the stacked structure including at least one metal layer.

5. The optical transmission module according to claim 4, wherein a first metal layer mostly arranged on the optical module section side of the metal layer is not grounded.

6. The optical transmission module according to claim 4, wherein a second metal layer mostly arranged on the connecting section side of the metal layer is grounded.

7. The optical transmission module according to claim 3, wherein

the reinforcement section comprises a three-layer structure in which a dielectric layer made of a dielectric body, and two metal layers made of metal for sandwiching the dielectric layer are stacked in the normal direction;

and

a first metal layer mostly arranged on the optical module section side is not grounded, and a second metal layer mostly arranged on the connecting section side is grounded.

8. The optical transmission module according to claim 7, wherein the dielectric layer is configured by a dielectric material with relative permittivity of one to two.

9. The optical transmission module according to claim 7, wherein

the optical module section comprises:

an optical element for receiving the optical signal transmitted through the optical wiring or emitting the optical signal to the optical wiring;

a control unit for amplifying the optical signal received by the optical element or driving the light emission of the optical signal to the optical wiring; and

an optical element wiring for connecting the optical element and the control unit,

wherein a distance in the normal direction of the first and second metal layers is longer than a distance in the normal direction of the first metal layer and the optical element wiring.

10. The optical transmission module according to claim 7, wherein an overlapping portion of the first and second metal layers seen from the normal direction has a smaller area than the metal layer having a smaller area of the first and second metal layers.

11. The optical transmission module according to claim 7,

wherein the circuit substrate includes a grounded shield layer on a surface, and

wherein the second metal layer is conducted with the shield layer.

12. The optical transmission module according to claim 2, wherein the connecting section is arranged on a side opposite to the electric wiring in the optical module section at the same substrate surface of the circuit substrate.

13. The optical transmission module according to claim 2, wherein the optical module section is arranged on a side opposite to the electric wiring in the connecting section at the same substrate surface of the circuit substrate.

14. The optical transmission module according to claim 1, wherein the bending portion is arranged on a side opposite to the optical module section in the connecting section at the same substrate surface of the circuit substrate.

15. An electronic device comprising the optical transmission module according to claim 1.

16. A method for manufacturing an optical transmission module including,

an optical module section comprising at least one of a reception module for converting an optical signal transmitted by an optical wiring to an electric signal or a transmission module section for converting the electric signal to the optical single and transmitting the optical signal through the optical wiring;

a circuit substrate including an electric wiring for transmitting the electric signal; and

a connecting section including an external connection terminal for providing the electric signal to the optical module section and the circuit substrate,

wherein the optical module section and the connecting section are mounted on a same substrate surface of the circuit substrate, and

wherein the method comprises the step of;

assembling the optical transmission module by combining a mounting stage of mounting the optical wiring on the optical module section; and

bending the circuit substrate, in a bending stage, so that the substrate surface oppose each other at the back in a normal direction of the circuit substrate.

17. The method for manufacturing the optical transmission module according to claim 16, wherein the mounting stage is performed with the circuit substrate bent after the bending stage in the assembly step.

18. The method for manufacturing the optical transmission module according to claim 16, wherein the bending stage is performed with the optical wiring mounted on the optical module section after the mounting stage in the assembly step.