×

IMAGE PICKUP MODULE, MANUFACTURING METHOD THEREOF, AND ENDOSCOPIC DEVICE

  • US 20110224487A1
  • Filed: 01/25/2011
  • Published: 09/15/2011
  • Est. Priority Date: 03/15/2010
  • Status: Abandoned Application
First Claim
Patent Images

1. An image pickup module, comprising:

  • a solid-state image pickup element chip having an image pickup surface;

    a cover glass that covers the image pickup surface;

    a wiring board on which the solid-state image pickup element chip is mounted;

    a overlap portion in which an end portion of the solid-state image pickup element chip and an end portion of the wiring board overlap each other; and

    a connection terminal portion configured to electrically connect a first electrode portion formed on the end portion of the solid-state image pickup element chip and a second electrode portion formed on the end portion of the wiring board through a bump.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×