IMAGE PICKUP MODULE, MANUFACTURING METHOD THEREOF, AND ENDOSCOPIC DEVICE

• US 20110224487A1
• Filed: 01/25/2011
• Published: 09/15/2011
• Est. Priority Date: 03/15/2010
• Status: Abandoned Application

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Inventors: OGAWA, Teppei
• Application Number:
  US13/013,167
• Publication Number:
  US 20110224487A1
• Time in Patent Office: Days
• US Class Current: 600/109
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly

Abstract

Size reduction of an image pickup module is promoted, and reliability of electric connection and electric noise resistance are improved by decreasing the numbers of components and connection spots. The problems are solved by providing an image pickup module including a solid-state image pickup element chip having an image pickup surface, a cover glass that covers the image pickup surface, and a wiring board on which the solid-state image pickup element chip is mounted, in which the solid-state image pickup element chip and the wiring board have an overlap structure in which end portions thereof are overlapped with each other, and a first electrode portion formed on the end portion of the solid-state image pickup element chip and a second electrode portion formed on the end portion of the wiring board are electrically connected through a bump.

Claims

1. An image pickup module, comprising:

a solid-state image pickup element chip having an image pickup surface;

a cover glass that covers the image pickup surface;

a wiring board on which the solid-state image pickup element chip is mounted;

a overlap portion in which an end portion of the solid-state image pickup element chip and an end portion of the wiring board overlap each other; and

a connection terminal portion configured to electrically connect a first electrode portion formed on the end portion of the solid-state image pickup element chip and a second electrode portion formed on the end portion of the wiring board through a bump.

2. The image pickup module according to claim 1, wherein

the end portions of the solid-state image pickup element chip and the wiring board are sealed and fixed to each other by a resin.

3. The image pickup module according to claim 1, wherein

the first electrode is formed on a same plane as the image pickup surface.

4. The image pickup module according to claim 1, wherein

the wiring board is a flexible board having flexibility.

5. The image pickup module according to claim 1, wherein

the flexible board includes at least a base layer, a wiring pattern formed on the base layer, and a cover layer that covers a surface of the base layer on which the wiring pattern is formed.

10. An endoscopic device including the image pickup module according to claim 1.

6. A manufacturing method of an image pickup module including a solid-state image pickup element chip having an image pickup surface, a cover glass that covers the image pickup surface, and a wiring board on which the solid-state image pickup element chip is mounted, comprising:

aligning an end portion of the solid-state image pickup element chip and an end portion of the wiring board to overlap each other; and

electrically connecting, after the alignment, a first electrode portion formed on the end potion of the solid-state image pickup element chip and a second electrode portion formed on the end portion of the wiring board through a bump.

7. The manufacturing method of an image pickup module, according to claim 6, comprising:

applying a thermosetting resin on at least one of the end portions of the solid-state image pickup element chip and the wiring board; and

heating and curing the thermosetting resin in a state in which the first electrode portion and the second electrode portion are electrically connected to each other through the bump.

8. The manufacturing method of an image pickup module, according to claim 7, wherein

the heating of the thermosetting resin is performed indirectly through a tool that adsorbs the solid-state image pickup element chip.

9. The manufacturing method of an image pickup module, according to claim 7, wherein

the thermosetting resin is a low-temperature thermosetting resin that is cured at a temperature at which a solid-state image pickup element of the solid-state image pickup element chip is thermally deteriorated or below.