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MEMS SENSOR WITH INTEGRATED ASIC PACKAGING

  • US 20110227173A1
  • Filed: 08/02/2010
  • Published: 09/22/2011
  • Est. Priority Date: 03/17/2010
  • Status: Abandoned Application
First Claim
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1. A sensor assembly, comprising:

  • an integrated circuit (IC) substrate having an upper surface and operating circuitry;

    a micro-electro-mechanical systems (MEMS) sensor die attached to the upper surface of the IC substrate in a stacked configuration, the MEMS sensor die in operative communication with the operating circuitry of the IC substrate;

    a seal ring surrounding an outer periphery of the upper surface of the IC substrate; and

    a seal cap secured to the seal ring over the MEMS sensor die.

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