MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
First Claim
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1. A sensor assembly, comprising:
- an integrated circuit (IC) substrate having an upper surface and operating circuitry;
a micro-electro-mechanical systems (MEMS) sensor die attached to the upper surface of the IC substrate in a stacked configuration, the MEMS sensor die in operative communication with the operating circuitry of the IC substrate;
a seal ring surrounding an outer periphery of the upper surface of the IC substrate; and
a seal cap secured to the seal ring over the MEMS sensor die.
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Abstract
A sensor assembly comprises an integrated circuit (IC) substrate having an upper surface and operating circuitry, and a micro-electro-mechanical systems (MEMS) sensor die attached to the upper surface of the IC substrate in a stacked configuration. The MEMS sensor die in operative communication with the operating circuitry of the IC substrate. A seal ring surrounds an outer periphery of the upper surface of the IC substrate, and a seal cap is secured to the seal ring over the MEMS sensor die.
51 Citations
20 Claims
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1. A sensor assembly, comprising:
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an integrated circuit (IC) substrate having an upper surface and operating circuitry; a micro-electro-mechanical systems (MEMS) sensor die attached to the upper surface of the IC substrate in a stacked configuration, the MEMS sensor die in operative communication with the operating circuitry of the IC substrate; a seal ring surrounding an outer periphery of the upper surface of the IC substrate; and a seal cap secured to the seal ring over the MEMS sensor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 16)
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9. An electronic device, comprising:
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a supporting substrate having a top surface; a plurality of sensor assemblies mounted on the top surface of the supporting substrate, each of the sensor assemblies comprising; an integrated circuit (IC) die having a first surface and an opposing second surface, the first surface of the IC die coupled to the top surface of the supporting substrate; a micro-electro-mechanical systems (MEMS) sensor die operatively coupled to the IC die at the second surface in a die stack configuration, a seal ring surrounding an outer periphery of second surface of the IC die; and a seal cap secured to the seal ring over the MEMS sensor die. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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17. A multi-axis sensing device, comprising:
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an application-specific integrated circuit (ASIC) substrate having a top surface and operating circuitry; a plurality of micro-electro-mechanical systems (MEMS) inertial sensor dies attached to the top surface of the ASIC substrate in a stacked configuration, the MEMS inertial sensor dies coupled with the operating circuitry of the ASIC substrate; and a plurality of operational amplifiers mounted to the top surface of the ASIC substrate, each of the operational amplifiers coupled to a respective one of the MEMS sensor dies. - View Dependent Claims (18, 19, 20)
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Specification