Stacked Die Package for MEMS Resonator System
First Claim
1. A packaging structure for an electromechanical resonator system, the packaging structure comprising:
- a control chip for a microelectromechanical resonator;
an electromechanical resonator chip that (i) includes the microelectromechanical resonator and (ii) is mounted on the control chip in a stacked die configuration, wherein the electromechanical resonator chip is physically coupled to the control chip by a thermally conductive epoxy;
a lead frame including at least one electrical lead having a mounting surface and an electrical contact surface, wherein the stacked die configuration is (i) mounted on the mounting surface of the electrical lead and (ii) physically coupled thereto by an electrically insulating epoxy, and wherein the stacked die configuration is electrically coupled to the electrical lead; and
a mold compound, enclosing at least a portion of the lead frame and stacked die configuration of the control chip and the electromechanical resonator chip, wherein (i) the mounting surface of the electrical lead and the portion of the stacked die configuration which is mounted thereon are enclosed in the mold compound and (ii) the electrical contact surface of the electrical lead is an externally exposed portion of the packaging structure.
4 Assignments
0 Petitions
Accused Products
Abstract
A stacked die package for an electromechanical resonator system includes a chip that contains an electromechanical resonator bonded onto the control chip for the electromechanical resonator by a thermally and/or electrically conductive epoxy. In various embodiments, the electromechanical resonator can be a micro-electromechanical system (MEMS) resonator or a nano-electromechanical system (NEMS) resonator. Packaging configurations that may include the chip that contains the electromechanical resonator and the control chip include chip-on-lead (COL), chip-on-paddle (COP), and chip-on-tape (COT) packages. The stacked die package provides small package footprint and/or low package thickness, as well as low thermal resistance and a robust conductive path between the chip that contains the electromechanical resonator and the control chip.
-
Citations
17 Claims
-
1. A packaging structure for an electromechanical resonator system, the packaging structure comprising:
-
a control chip for a microelectromechanical resonator; an electromechanical resonator chip that (i) includes the microelectromechanical resonator and (ii) is mounted on the control chip in a stacked die configuration, wherein the electromechanical resonator chip is physically coupled to the control chip by a thermally conductive epoxy; a lead frame including at least one electrical lead having a mounting surface and an electrical contact surface, wherein the stacked die configuration is (i) mounted on the mounting surface of the electrical lead and (ii) physically coupled thereto by an electrically insulating epoxy, and wherein the stacked die configuration is electrically coupled to the electrical lead; and a mold compound, enclosing at least a portion of the lead frame and stacked die configuration of the control chip and the electromechanical resonator chip, wherein (i) the mounting surface of the electrical lead and the portion of the stacked die configuration which is mounted thereon are enclosed in the mold compound and (ii) the electrical contact surface of the electrical lead is an externally exposed portion of the packaging structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification