Microfluidic System for Purposes of Analysis and Diagnosis and Corresponding Method for Producing a Microfluidic System

• US 20110229375A1
• Filed: 03/17/2011
• Published: 09/22/2011
• Est. Priority Date: 03/18/2010
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Bruendel, Mathias, Scholz, Ulrike, Ehrenpfordt, Ricardo, Rupp, Jochen, Haag, Frieder
• Granted Patent: US 9,101,929 B2
• Time in Patent Office: Days
• US Class Current: 422/68.1
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01L 2200/027 for microfluidic devices
• CPC Class Codes: B01L 2300/0663 Whole sensors
• CPC Class Codes: B01L 2300/0874 Three dimensional network
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/16 Surface properties and coatings
• CPC Class Codes: B01L 3/5027 by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip B01L3/5023 takes precedence; micromixers B01F33/30; microreactors for synthesis B01J19/0093; microcapillary devices in general B81B1/00
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B81B 2201/036 Micropumps
• CPC Class Codes: B81B 2201/054 Microvalves
• CPC Class Codes: B81B 2207/098 Arrangements not provided for in groups B81B2207/092 - B81B2207/097
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor

Abstract

A microfluidic system for purposes of analysis and diagnosis is made up of layers arranged substantially one above the other. The microfluidic system includes at least a first and a second conducting-through layer, which respectively comprise at least one channel for a fluid to be conducted through in the respective conducting-through layer. The microfluidic system further includes at least one chip layer, which comprises at least one active, micromechanical element, the active, micromechanical element being in operative connection with at least one of the channels, and the chip layer being arranged between the first and the second conducting-through layer, and the channels being fluidically connected to one another. A corresponding production method is disclosed in addition to the microfluid system.

Claims

1. A microfluidic system for use in analysis and diagnosis, comprising:

at least one substrate in the form of a contact redistribution layer which comprises at least one opening configured for fluid to be conducted through;

at least a first conducting-through layer which comprises at least one channel for fluid to be conducted through; and

at least a first chip layer which comprises at least one active element, the at least one active element being in operative connection with the at least one channel, and the first chip layer being arranged between the first conducting-through layer and the at least one substrate,

wherein the first chip layer comprises at least one passage which fluidically connects the at least one opening of the substrate to the channel of the conducting-through layer.

2. The microfluidic system according to claim 1, further comprising:

a second chip layer arranged on the first conducting-through layer, the second chip layer comprising at least one further active element, and the at least one further active element being in operative connection with at least the channel.

3. The microfluidic system according to claim 1, further comprising:

a second conducting-through layer comprising at least one channel which is fluidically connected to the at least one opening of the substrate, the second conducting-through layer being arranged below the substrate.

4. The microfluidic system according to claim 1, wherein:

the chip layer and/or the active element comprises at least one contact region for electrical and/or fluidic contacting.

5. The microfluidic system according to claim 1, further comprising:

a housing in the form of a molding compound.

6. The microfluidic system according to claim 1, wherein:

the first chip layer comprises silicon, and

the at least one conducting-through layer comprises a plastic.

7. The microfluidic system according to claim 1, wherein the contact redistribution layer is arranged to contact the first chip layer.

8. The microfluidic system according to claim 1, further comprising:

wire bonds and/or flip-chip contacts that are arranged for electrical connecting of the active element and/or the chip layer to a contact layer.

14. The microfluidic system of claim 1, wherein the at least one active element is a micromechanical element.

9. A method for producing a microfluidic system, comprising:

i) creating at least one opening and/or channel for fluids to be conducted through in a substrate in the form of a contact redistribution layer,

ii) creating at least one channel for fluids to be conducted through in at least one chip layer, the chip layer comprising at least one active element,

iii) fixing the chip layer on the substrate in such a way that the openings and/or channels are fluidically connected to the at least one channel of the chip layer,

iv) fixing a first conducting-through layer on the chip layer, and

v) creating at least one channel in the first conducting-through layer in such a way that the channel of the chip layer fluidically connects the channel of the conducting-through layer.

10. The method according to claim 9, further comprising:

arranging an active element of a second chip layer on the first conducting-through layer in such a way that the active element is in operative connection with at least the channel.

11. The method according to at least claim 9, further comprising:

arranging at least one channel of a second conducting-through layer in such a way that said channel is fluidically connected to the openings and/or channels of the substrate, the second conducting-through layer being arranged below the substrate.

12. The method according to claim 9, wherein:

the creation of the channel of the first conducting-through layer and/or the fixing of the first conducting-through layer includes at least partially removing of a bonding layer.

13. The method according to claim 9, further comprising:

creating a housing by transfer molding or injection molding, said housing containing the substrate, the chip layer, and the first conducting-through layer.

15. The method of claim 9, wherein the at least one active element is a micromechanical element.