Method and Apparatus for Silicon Film Deposition

• US 20110230008A1
• Filed: 05/04/2010
• Published: 09/22/2011
• Est. Priority Date: 03/17/2010
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Tran, Truc T., Lakshmanan, Annamalai, Tang, Jianshe, Sullivan, Jeffrey S.
• Application Number:
  US12/773,497
• Publication Number:
  US 20110230008A1
• Time in Patent Office: Days
• US Class Current: 438/96
• CPC Class Codes: C23C 16/24 Deposition of silicon only
• CPC Class Codes: C23C 16/452 by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
• CPC Class Codes: C23C 16/45514 Mixing in close vicinity to the substrate
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/4557 Heated nozzles
• CPC Class Codes: C23C 16/45574 Nozzles for more than one gas
• CPC Class Codes: C23C 16/5096 Flat-bed apparatus
• CPC Class Codes: H01L 31/1824 Special manufacturing methods for microcrystalline Si, uc-Si
• CPC Class Codes: H01L 31/202 including only elements of Group IV of the Periodic Table
• CPC Class Codes: Y02E 10/545 Microcrystalline silicon PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Embodiments of the present invention are directed to apparatus and methods for depositing amorphous and microcrystalline silicon films during the formation of solar cells. Specifically, embodiments of the invention provide for a pre-heated hydrogen-containing gas to be introduced into a processing chamber separately from the silicon-containing gas. A plasma, struck from the heated hydrogen-containing gas, reacts with the silicon-containing gas to produce a silicon film on a substrate.

Claims

1. A method for depositing a silicon film on a substrate, comprising:

heating a hydrogen-containing gas;

delivering the heated hydrogen-containing gas into a plasma generation region to energize the hydrogen-containing gas to generate hydrogen radicals for use in a processing region of a processing chamber, the processing region being defined as a space between a showerhead, the substrate and walls of the processing chamber; and

introducing a silicon-containing gas into the processing region of the processing chamber separate from the hydrogen-containing gas to prevent mixing with the hydrogen radicals outside of the processing region of the processing chamber.

2. The method of claim 1, wherein the plasma generation region is in the processing region of the chamber.

3. The method of claim 1, wherein the plasma generation region is remote from and in fluid communication with the processing region of the chamber.

4. The method of claim 1, further comprising monitoring the temperature of the hydrogen-containing gas.

5. The method of claim 4, further comprising heating the hydrogen-containing gas a different rate.

6. The method of claim 1, wherein the processing region includes a substrate support.

7. The method of claim 6, further comprising delivering the silicon-containing gas from a gas source to the processing region via a plurality of gas passages within the showerhead.

8. The method of claim 7, wherein the hydrogen-containing gas or hydrogen radicals are introduced to the processing region of the processing chamber through a central opening in the showerhead, the central opening being isolated from the plurality of gas passages.

9. The method of claim 1, wherein the hydrogen-containing gas or hydrogen radicals are introduced to the processing region of the processing chamber through an isolated line passing through the walls of the processing chamber.

10. The method of claim 1, further comprising introducing one or more of trimethylboron (TMB), methane and phosphine to the processing region of the processing chamber.

11. An apparatus for depositing a silicon film, comprising:

a processing chamber having a plurality of walls, a showerhead, and a substrate support defining a processing region within the processing chamber, the showerhead comprising a plurality of gas passages;

a silicon-containing gas source coupled to the processing region through the plurality of gas passages; and

a hydrogen-containing gas source coupled to the processing region through a gas conduit, the gas conduit thermally coupled to a heater to increase the temperature of the hydrogen-containing gas, the hydrogen-containing gas source isolated from the silicon-containing gas source to prevent mixing of the hydrogen-containing gas and the silicon-containing gas outside of the processing region.

12. The apparatus of claim 11, further comprising a remote plasma source in fluid communication with the gas conduit and downstream from the heater, the remote plasma source operable to generate hydrogen radicals in the hydrogen-containing gas prior to introduction of the hydrogen-containing gas to the processing region.

13. The apparatus of claim 12, wherein the gas conduit is positioned to introduce the hydrogen-containing gas to the processing region through the chamber wall.

14. The apparatus of claim 12, wherein the showerhead has a central opening in fluid communication with the gas conduit.

15. The apparatus of claim 11, further comprising at least one supplemental processing gas source coupled to the processing region of the processing chamber.

16. The apparatus of claim 15, wherein the at least one supplemental processing gas source comprises one or more of trimethylboron (TMB), methane and phosphine.

17. The apparatus of claim 15, wherein the at least one supplemental processing gas source is coupled to the processing region through the plurality of gas passages in the showerhead.

18. The apparatus of claim 17, further comprising a proportioning valve to isolate and mix the silicon-containing gas from the at least one supplemental processing gas.

19. The apparatus of claim 11, further comprising a temperature feedback circuit including a temperature probe coupled to the heater, the temperature feedback circuit configured to measure the temperature of the hydrogen-containing gas and adjust the heater based on the measured temperature to control the hydrogen-containing gas temperature.