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CONNECTOR SYSTEM HAVING CONTACT OVERLAPPING VIAS

  • US 20110230067A1
  • Filed: 03/22/2010
  • Published: 09/22/2011
  • Est. Priority Date: 03/22/2010
  • Status: Active Grant
First Claim
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1. An electronic connector system comprising:

  • an electronic package having a body with a conductive member disposed on a mating surface of the body, the conductive member coupled with a conductive via that extends into the body and is oriented along a center axis; and

    an interposer connector assembly including a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad, wherein the contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.

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