CONNECTOR SYSTEM HAVING CONTACT OVERLAPPING VIAS

• US 20110230067A1
• Filed: 03/22/2010
• Published: 09/22/2011
• Est. Priority Date: 03/22/2010
• Status: Active Grant

• Current Assignee: TE Connectivity Corporation (TE Connectivity Limited)
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Limited)
• Inventors: Lin, Bin, Millard, Steven Jay, Champion, Bruce Allen
• Granted Patent: US 8,007,287 B1
• Time in Patent Office: Days
• US Class Current: 439/65
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/2442 with a single cantilevered beam
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10378 Interposers

Abstract

An electronic connector system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis. The interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.

Claims

1. An electronic connector system comprising:

an electronic package having a body with a conductive member disposed on a mating surface of the body, the conductive member coupled with a conductive via that extends into the body and is oriented along a center axis; and

an interposer connector assembly including a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad, wherein the contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.

2. The system according to claim 1, wherein the contact is disposed between the via of the electronic package and the substrate of the interposer connector assembly along the center axis of the via when the electronic package mates with the interposer connector assembly.

3. The system of claim 1, wherein the contact of the interposer connector assembly extends over a footprint on the electronic package that is defined by a surface area on the electronic package over which the contact extends, at least a majority of the via disposed in the footprint.

4. The system of claim 1, wherein the conductive pad includes a framing portion and a mounting portion spaced apart from each other, the framing portion extending around at least a portion of a periphery of the via, the contact engaging the mounting portion when the electronic package mates with the interposer connector assembly.

5. The system of claim 1, wherein the via comprises a hole extending into the body of the electronic package that is at least one of plated and filled with a conductive material, the conductive pad being electrically joined with the conductive material in the via.

6. The system of claim 1, wherein the contact has a footprint on the electronic package that is defined by a surface area on the mating surface of the electronic package over which the contact extends when the electronic package and the interposer connector assembly mate, the footprint and the conductive pad being elongated along a common direction.

7. The system of claim 1, wherein the electronic package is a first electronic package and the interposer connector assembly includes opposite first and second sides with a plurality of the contacts mounted on the first and second sides and electrically coupled with each other, further comprising a second electronic package having a conductive pad and a conductive via, the contacts of the interposer connector assembly engaging the conductive pads and extending over the vias of the first and second electronic packages when the first and second electronic packages engage the interposer connector assembly.

8. The system of claim 1, wherein the contact of the interposer connector assembly extends from a fixation end mounted to the conductive pad to an outer end, the center axis of the via extending through the contact between the fixation and the outer end when the electronic package engages the interposer connector assembly.

9. The system of claim 1, wherein the conductive pad is a first conductive pad and the via is a first conductive via, further comprising a second conductive pad mounted to the electronic package and a second conductive via coupled with the second conductive pad, wherein the contact of the interposer connector assembly engages the first conductive pad and the center axis of the second via extends through the contact.

10. An electronic connector system comprising:

an electronic package having a body with a conductive member disposed on a mating surface of the body, the conductive member coupled with a conductive via that extends into the body; and

an interposer connector assembly including a substrate with a conductive pad mounted to the substrate and an elongated contact joined to the conductive pad, wherein the contact having a footprint on the electronic package that is defined by a surface area on the mating surface of the electronic package over which the contact extends when the electronic package and the interposer connector assembly mate, further wherein at least a portion of the via is disposed within the footprint.

11. The system of claim 10, wherein the via is oriented along a center axis and the contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.

12. The system according to claim 10, wherein the via is oriented along a center axis and the contact engages the conductive member when the electronic package mates with the interposer connector assembly, the contact being disposed between the via of the electronic package and the substrate of the interposer connector assembly along the center axis of the via when the electronic package mates with the interposer connector assembly.

13. The system of claim 10, wherein at least a majority of the via is disposed in the footprint when the electronic package and the interposer connector assembly mate with each other.

14. The system of claim 10, wherein the conductive pad is elongated and includes a framing portion and a mounting portion spaced apart from each other, the framing portion extending around at least a portion of a periphery of the via, the contact engaging the mounting portion when the electronic package mates with the interposer connector assembly.

15. The system of claim 10, wherein the via comprises a hole extending into the body of the electronic package that is at least one of plated and filled with a conductive material, the conductive pad being electrically joined with the conductive material in the via.

16. The system of claim 10, wherein the footprint of the contact and the conductive pad are elongated along a common direction when the electronic package and the interposer connector assembly mate with each other.

17. The system of claim 10, wherein the via is oriented along a center axis and the contact of the interposer connector assembly extends from a fixation end mounted to the conductive pad to an outer end, the center axis of the via extending through the contact between the fixation and the outer end when the electronic package engages the interposer connector assembly.

18. The system of claim 10, wherein the conductive pad is a first conductive pad and the via is a first conductive via, further comprising a second conductive pad mounted to the electronic package and a second conductive via coupled with the second conductive pad, wherein the contact of the interposer connector assembly engages the first conductive pad and the footprint of the contact encompasses at least a portion of the second via.