MODEL IMPORT FOR ELECTRONIC DESIGN AUTOMATION
1 Assignment
0 Petitions
Accused Products
Abstract
Methods and systems for providing processing parameters in a secure format are disclosed. In one aspect, a method for providing semiconductor fabrication processing parameters to a design facility is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a model from the set of processing parameters; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; and communicating the set of matrices to the design facility. In another aspect, a method for providing semiconductor fabrication processing parameters is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a processing model from the set of processing parameters; encrypting the processing model into a format for use with a plurality of EDA tools; and communicating the encrypted processing model format to a design facility.
91 Citations
38 Claims
-
1-18. -18. (canceled)
-
19. A method, comprising:
-
providing a set of processing parameters from a fabrication facility; creating a model from the set of processing parameters, the model being in the form of electronic data; using a processor for; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; creating hot spot detection rules and hot spot correction rules based on the set of processing parameters; communicating the set of matrices, the hot spot detection rules, and the hot spot correction rules to a design facility; and wherein the set of matrices, the hot spot detection rules, and the hot spot correction rules are adapted for use with a plurality of EDA tools. - View Dependent Claims (20, 21, 22, 23, 24)
-
-
25. In a data processing system, a method for providing semiconductor fabrication processing parameters to a design facility, the method comprising:
-
providing a set of semiconductor processing parameters from a fabrication facility to an input of a processor; the processor establishing a processing model based on the set of semiconductor processing parameters; the processor creating hot spot detection rules and hot spot correction rules based on the set of semiconductor processing parameters; the processor converting the processing model into a set of kernels; and an output of the processor sending the set of kernels to the design facility in a format that can be used with a first electronic design automation (EDA) tool. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33)
-
-
34. In a data processing system, a method for providing semiconductor fabrication processing parameters to a design entity, the method comprising:
-
providing a set of processing parameters from a fabrication entity to an input of a processor; the processor creating a processing model from the set of semiconductor processing parameters; the processor creating hot spot detection rules and hot spot correction rules based on the set of semiconductor processing parameters; the processor converting the processing model into a set of two-dimensional kernels; the processor converting the set of two-dimensional kernels into a set of matrices, the set of matrices being in a format recognizable by an electronic design automation (EDA) tool; and an output of the processor communicating the set of matrices to the design entity. - View Dependent Claims (35, 36, 37, 38)
-
Specification