METHOD OF ATTACHING DIE TO CIRCUIT BOARD WITH AN INTERMEDIATE INTERPOSER
First Claim
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1. A printed circuit board comprising:
- a board having a substrate formed of a first material having a first coefficient of thermal expansion, and having circuit traces;
a die secured to said board, said die having circuit traces electrically connected to said board circuit traces, and said die having a base formed of a second material having a second coefficient of thermal expansion different than said first coefficient of thermal expansion; and
an interposer material positioned between said die and said board, said interposer having an electrical connection connecting said die circuit traces to said board circuit traces, said interposer being formed of a third material having a coefficient of thermal expansion intermediate said first and second coefficients of thermal expansion; and
wherein said interposer includes a base material with a plurality of openings, said openings receiving a conductive material to connect said die to said board.
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Abstract
A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.
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Citations
18 Claims
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1. A printed circuit board comprising:
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a board having a substrate formed of a first material having a first coefficient of thermal expansion, and having circuit traces; a die secured to said board, said die having circuit traces electrically connected to said board circuit traces, and said die having a base formed of a second material having a second coefficient of thermal expansion different than said first coefficient of thermal expansion; and an interposer material positioned between said die and said board, said interposer having an electrical connection connecting said die circuit traces to said board circuit traces, said interposer being formed of a third material having a coefficient of thermal expansion intermediate said first and second coefficients of thermal expansion; and wherein said interposer includes a base material with a plurality of openings, said openings receiving a conductive material to connect said die to said board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A printed circuit board comprising:
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a board having a substrate formed of a glass filled epoxy having a first coefficient of thermal expansion, said board having circuit traces; a die secured to said board, said die having a base formed of a silicon having a second coefficient of thermal expansion, and said die being electrically connected to said board; and an interposer material positioned between said die and said board, said interposer including a base material with a plurality of openings receiving a conductive material to provide an electrical connection between said die and said board. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification