SPUTTERING SYSTEM
First Claim
1. A device for sputtering at least one selected material onto a substrate and bringing about a reaction of this material, the device comprising a vacuum chamber, in which a substrate holder is arranged, at least one magnetron sputtering mechanism, which is arranged in a workstation close to the substrate holder and which has a target of the selected material which is suitable for producing a first plasma for sputtering at least one material onto the substrate, as well as a secondary plasma mechanism for producing a secondary plasma, which is arranged in the workstation close to the magnetron sputtering mechanism (15) and close to the substrate holder, the sputtering mechanism and the secondary plasma mechanism forming a sputtering zone and an activation zone, wherein at least two electromagnets and/or radially magnetized toric magnets as well as at least one magnetic multipole, which is formed from a plurality of permanent magnets, are arranged to produce magnetic fields to include the secondary plasma.
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Accused Products
Abstract
The invention relates to a device (10) for sputtering at least one selected materialonto a substrate (5) and bringing about a reaction of this material, comprising a vacuum chamber (11), in which a substrate holder (12) is arranged, at least one magnetron sputtering mechanism (15), which is arranged in a workstation close to the substrate holder (12) and which has a target of the selected material which is suitable for producing a first plasma for sputtering at least one material onto the substrate (5), as well as a secondary plasma mechanism (16) for producing a secondary plasma, which is arranged in the workstation close to the magnetron sputtering mechanism (15) and close to the substrate holder (12), the sputtering mechanism (15) and the secondary plasma mechanism (16) forming a sputtering zone and an activation zone. At least two electromagnets (1, 3) and/or radiallymagnetized toric magnets as well as at least one magnetic multipole (2), which is formed from a plurality of permanent magnets, are arranged to produce magnetic fields to include the secondary plasma. The invention also relates to a method for coating a substrate, in which firstly material is deposited on a substrate by means of a sputtering process and the deposited material then reacts in a plasma, which contains the necessary reactive species, to form a compound, wherein the plasma density and the degree of ionization of the plasma are increased with the aid of magnetic fields, which are produced by at least two electromagnets (1, 3) and/or radially magnetized toric magnets as well as at least one magnetic multipole (2), which is formed from a plurality of permanent magnets.
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Citations
15 Claims
- 1. A device for sputtering at least one selected material onto a substrate and bringing about a reaction of this material, the device comprising a vacuum chamber, in which a substrate holder is arranged, at least one magnetron sputtering mechanism, which is arranged in a workstation close to the substrate holder and which has a target of the selected material which is suitable for producing a first plasma for sputtering at least one material onto the substrate, as well as a secondary plasma mechanism for producing a secondary plasma, which is arranged in the workstation close to the magnetron sputtering mechanism (15) and close to the substrate holder, the sputtering mechanism and the secondary plasma mechanism forming a sputtering zone and an activation zone, wherein at least two electromagnets and/or radially magnetized toric magnets as well as at least one magnetic multipole, which is formed from a plurality of permanent magnets, are arranged to produce magnetic fields to include the secondary plasma.
- 14. A method for coating a substrate, in which firstly material is deposited on a substrate by means of a sputtering process and the deposited material then reacts in a plasma, which contains the necessary reactive species, to form a compound, wherein the plasma density and the degree of ionization of the plasma are increased with the aid of magnetic fields, which are produced by at least two electromagnets and/or radially magnetized toric magnets as well as at least one magnetic multipole, which is formed from a plurality of permanent magnets.
Specification