SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
First Claim
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1. A substrate processing apparatus comprising:
- a process chamber for processing a substrate;
a substrate holder installed in the process chamber to hold the substrate;
a gas introduction part installed below the substrate held by the substrate holder for introducing a gas toward a back surface of the substrate; and
an electromagnetic wave introduction part installed over the substrate held by the substrate holder for introducing an electromagnetic wave.
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Abstract
A substrate processing apparatus and a substrate processing method capable of supplying uniform electromagnetic wave power and performing uniform heating are provided. The substrate processing apparatus includes a process chamber for processing a wafer, a boat installed in the process chamber to hold the wafer, a gas introduction part installed below the wafer held by the boat for introducing a gas toward a back surface of the wafer, and a waveguide port installed over the wafer held by the boat for introducing an electromagnetic wave.
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Citations
6 Claims
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1. A substrate processing apparatus comprising:
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a process chamber for processing a substrate; a substrate holder installed in the process chamber to hold the substrate; a gas introduction part installed below the substrate held by the substrate holder for introducing a gas toward a back surface of the substrate; and an electromagnetic wave introduction part installed over the substrate held by the substrate holder for introducing an electromagnetic wave. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification