System and Method To Track And Authenticate Semiconductor Chips, Multi-Chip Package Modules, And Their Derivative System Products

• US 20110233271A1
• Filed: 07/21/2010
• Published: 09/29/2011
• Est. Priority Date: 03/23/2010
• Status: Abandoned Application

• Current Assignee: RFMarq, Inc.
• Original Assignee: RFMarq, Inc.
• Inventors: Lin, Chang-Ming
• Application Number:
  US12/841,021
• Publication Number:
  US 20110233271A1
• Time in Patent Office: Days
• US Class Current: 235/375
• CPC Class Codes: H01L 2223/54433 containing identification or tracking information
• CPC Class Codes: H01L 2223/5444 for electrical read out
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

A method for providing identity authentication and tracking for a multi-chip package (MCP) module or a designated semiconductor chip formed inside a MCP module where the MCP module is provided with a first communication function includes providing a communication element formed on the MCP base where the communication element includes a memory unit for storing identification information; providing an electrical connection between the communication element and the designated semiconductor chip; accessing by the designated semiconductor chip the information stored in the memory unit of the communication element through the electrical connection; and providing the information stored in the communication element to a system outside of the MCP module through the first communication function where the information is used at least to track or authenticate the MCP module or the designated semiconductor chip of the MCP module.

Claims

1. A method for providing identity tracking and authentication for a multi-chip package (MCP) module or a designated semiconductor chip selected from one or more semiconductor chips formed on an MCP base of the MCP module, the MCP module being provided with a first communication function, the method comprising:

providing a communication element formed on the MCP base, the communication element including a memory unit for storing information including at least identity information of the designated semiconductor chip or the MCP module;

providing an electrical connection between the communication element and the designated semiconductor chip;

accessing by the designated semiconductor chip the information stored in the memory unit of the communication element through the electrical connection; and

providing the information stored in the communication element to a system outside of the MCP module through the first communication function of the MCP module, the information being used at least to track or authenticate the MCP module or the designated semiconductor chip of the MCP module.

2. The method of claim 1, wherein the MCP base comprises a multilayer interconnect substrate and providing an electrical connection between the communication element and the designated semiconductor chip comprises:

providing an electrical connection formed on or in the multilayer interconnect substrate between the communication element and the designated semiconductor chip.

3. The method of claim 1, wherein providing an electrical connection between the communication element and the designated semiconductor chip comprises:

providing an electrical connection between the communication element and the designated semiconductor chip using bond wires, solder bumps, gold bumps, conductive pastes, conductive inks or a flexible connector with solder joint bump.

4. The method of claim 1, wherein the MCP base comprises a die paddle and providing an electrical connection between the communication element and the designated semiconductor chip comprises:

providing an electrical connection between the communication element and the designated semiconductor chip using bond wires, solder bumps, gold bumps, conductive pastes, conductive inks or a flexible connector with solder joint bump.

5. The method of claim 1, further comprising:

providing two-way communication through the electrical connection between the communication element and the designated semiconductor chip; and

providing information from the designated semiconductor chip to the communication element to be stored in the memory unit of the communication element.

6. The method of claim 1, wherein the first communication function of the MCP module comprises wireless communication or wired communication.

7. The method of claim 1, wherein providing the information to a system outside of the MCP module comprises providing the information to one of a local area network, a wireless communication network, a satellite communication network, a cellular telephone communication network, or a combination of wired and wireless networks.

8. The method of claim 1, further comprising:

generating an identification for the designated semiconductor chip or the MCP module using an algorithm on the communication element or the designated semiconductor chip.

9. The method of claim 1, wherein the information stored in the memory unit of the communication element comprises identity information, part number, model number, model name, brand name, maker, logo design, and original equipment manufacturer (OEM), production and/or distribution history of the MCP module and/or the designated semiconductor chip, the original owner of the microelectronic device or system, wherein the identity information comprises an identity code or an algorithm to generate an identity code in response to interrogations from the one or more semiconductor chips on the MCP base or from a system external to the MCP module.

10. The method of claim 1, further comprising:

providing a power supply connection from a power terminal of the MCP module formed in the MCP base to the communication element.

11. The method of claim 1, further comprising:

accessing the information stored in the memory unit of the communication element through secured interrogation or secured authentication procedures.

12. The method of claim 1, further comprising:

providing a wireless communication circuit to the communication element to form a wireless communication element;

connecting the wireless communication element to an antenna; and

accessing the information stored in the memory unit of the wireless communication element through wireless communication with the wireless communication element using a wireless communication device.

13. The method of claim 12, wherein the wireless communication device is in communication with wired or wireless communication networks and the method further comprises:

providing the information stored in the memory unit of the wireless communication element to the wired or wireless communication networks through the wireless communication device.

14. The method of claim 12, wherein the wireless communication element is configured to support wireless communication through radio frequency communication, Bluetooth radio communication, Wi-Fi communication, WiMax communication or ZigBee wireless communication.

15. The method of claim 12, further comprising:

accessing the information stored in the memory unit of the wireless communication element using a wireless reader device, the wireless reader device being coupled to a wired or wireless network.

16. The method of claim 12, further comprising:

forming the antenna on or in the MCP base; and

electrically connecting the antenna to the wireless communication element.

17. The method of claim 12, further comprising:

forming the antenna on and electrically insulated from a lead frame of the MCP module or within the encapsulation material of the MCP module; and

electrically connecting the antenna to the wireless communication element.

18. The method of claim 12, further comprising:

forming the antenna inside a package body of the MCP module, the antenna being electrically connected to the wireless communication element through an electrical connection.

19. The method of claim 18, further comprising:

electrically connecting the antenna to the wireless communication element from antenna bonding pads formed on the package body of the MCP module or through an electrical connection formed by solder bumps or conductive adhesives formed on a flexible connector to corresponding interconnects formed on the MCP base; and

electrically connecting the interconnects formed on the MCP base to corresponding bonding pads on the wireless communication element using wire bonds or solder bumps or conductive adhesives.

20. The method of claim 12, wherein the wireless communication element comprises an RFID chip and the method further comprises:

accessing the information stored in the memory unit of the wireless communication element using an RFID reader.

21. The method of claim 12, further comprising:

providing instructions to the wireless communication element through wireless communication, the instruction including at least a read command, a write command, a lock command or a kill command.

22. The method of claim 12, wherein the wireless communication element comprises a Global Positioning system (GPS) functional block.

23. A method for providing identity tracking and authentication for a multi-chip package (MCP) module or a designated semiconductor chip selected from one or more semiconductor chips formed on an MCP base of the MCP module, the MCP module being provided with a first communication function, the method comprising:

providing a wireless communication element formed on the MCP base, the wireless communication element including a memory unit for storing information including at least identity information of the designated semiconductor chip or the MCP module and including a wireless communication circuit;

providing a wireless communication transceiver formed on the MCP base and in communication with the designated semiconductor chip, the wireless communication transceiver providing a second communication function;

accessing by the wireless communication transceiver the information stored in the memory unit of the wireless communication element through the second communication function; and

providing the information stored in the wireless communication element to a system outside of the MCP module through the first communication function of the MCP module, the information being used at least to track or authenticate the MCP module or the designated semiconductor chip of the MCP module.

24. The method of claim 23, wherein the second communication function comprises one of radio frequency communication, Bluetooth radio communication, Wi-Fi communication, WiMax communication or ZigBee wireless communication.

25. A multi-chip package (MCP) module including one or more semiconductor chips formed on an MCP base of the MCP module, the MCP module being provided with a first communication function, the MCP module comprising:

a communication element formed on the MCP base, the communication element including a memory unit for storing information including at least identity information of the designated semiconductor chip or the MCP module; and

an electrical connection between the communication element and a designated semiconductor chip selected from the one or more semiconductor chips formed on an MCP base of the MCP module,

wherein the designated semiconductor chip accesses the information stored in the memory unit of the communication element through the electrical connection, and provides the information stored in the communication element to a system outside of the MCP module through the first communication function of the MCP module, the information being used at least to track or authenticate the MCP module or the designated semiconductor chip of the MCP module.

26. The MCP module of claim 25, wherein the MCP base comprises a multilayer interconnect substrate and the electrical connection is formed on or in the multilayer interconnect substrate.

27. The MCP module of claim 25, wherein the MCP base comprises a die paddle.

28. The MCP module of claim 25, wherein the electrical connection formed between the communication element and the designated semiconductor chip comprises one of a bond wire solder bumps, gold bumps, conductive pastes, conductive inks or a flexible connector with solder joint bump.

29. The MCP module of claim 25, wherein the electrical connection provides two-way communication between the communication element and the designated semiconductor chip and the designated semiconductor chip provides information to the communication element on the electrical connection to be stored in the memory unit of the communication element.

30. The MCP module of claim 25, wherein the communication element further includes a wireless communication circuit to form a wireless communication element, the wireless communication being connected to an antenna, and wherein the information stored in the memory unit of the wireless communication element is assessed through wireless communication with the wireless communication element using a wireless communication device.

31. The MCP module of claim 30, wherein the MCP base comprises a multilayer interconnect substrate and the antenna is formed on or in the multilayer interconnect substrate,

32. The MCP module of claim 30, wherein the antenna is formed on and electrically insulated from a lead frame of the MCP module or within the encapsulation material of the MCP module or inside a package body of the MCP module.