ADHESIVE-BONDED SUBSTRATES IN A MULTI-CHIP MODULE
First Claim
1. A multi-chip module (MCM), comprising:
- a first substrate having a first surface, wherein a first set of proximity connectors are disposed on the first surface;
a second substrate having a second surface that faces the first surface, wherein a second set of proximity connectors are disposed on the second surface, wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing, and wherein the second surface includes a channel having an inner surface that is recessed below the second surface; and
an adhesive, mechanically coupled to the first substrate and the inner surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, which facilitates proximity communication of signals between the first set of proximity connectors and the second set of proximity connectors.
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Accused Products
Abstract
A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces.
23 Citations
20 Claims
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1. A multi-chip module (MCM), comprising:
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a first substrate having a first surface, wherein a first set of proximity connectors are disposed on the first surface; a second substrate having a second surface that faces the first surface, wherein a second set of proximity connectors are disposed on the second surface, wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing, and wherein the second surface includes a channel having an inner surface that is recessed below the second surface; and an adhesive, mechanically coupled to the first substrate and the inner surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, which facilitates proximity communication of signals between the first set of proximity connectors and the second set of proximity connectors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An MCM, comprising:
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a first substrate having a first surface, wherein a first set of proximity connectors are disposed on the first surface; a second substrate having a second surface that faces the first surface, wherein a mesa having a third surface protrudes above the second surface, wherein a second set of proximity connectors are disposed on the third surface, wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing; and an adhesive, mechanically coupled to the first surface and the second surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, which facilitates proximity communication of signals between the first set of proximity connectors and the second set of proximity connectors. - View Dependent Claims (10, 11, 12, 13)
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14. A system, comprising an MCM, wherein the MCM includes:
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a first substrate having a first surface, wherein first proximity connectors are disposed on the first surface; a second substrate having a second surface that faces the first surface, wherein a second set of proximity connectors are disposed on the second surface, wherein the first set of proximity connectors and the second set of proximity connectors are separated by a spacing, and wherein the second surface includes a channel having an inner surface that is recessed below the second surface; and an adhesive, mechanically coupled to the first substrate and the inner surface, having a thickness that is larger than the spacing, thereby maintaining alignment and providing shear strength in the MCM, which facilitates proximity communication of signals between the first set of proximity connectors and the second set of proximity connectors. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification