IC PACKAGE STIFFENER WITH BEAM

• US 20110235304A1
• Filed: 03/23/2010
• Published: 09/29/2011
• Est. Priority Date: 03/23/2010
• Status: Abandoned Application

• Current Assignee: Alcatel-Lucent SA (Nokia Corporation)
• Original Assignee: Alcatel-Lucent Canada Incorporated (Nokia Corporation)
• Inventors: Brown, Paul J., Chan, Alex L.
• Application Number:
  US12/729,882
• Publication Number:
  US 20110235304A1
• Time in Patent Office: Days
• US Class Current: 361/820
• CPC Class Codes: H01L 2224/73153 Bump and layer connectors
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/3511 Warping

Abstract

Various exemplary embodiments relate to a stiffener for use with and integrated circuit (IC). The stiffener can be attached to the IC, and can utilize a planar portion and one or more beam portions that project from the planar portion at a non-zero angle. The stiffener can alternatively include a frame formed of beam portions that are adjacent the sides of the IC. The stiffener can provide added stiffness to the IC package to resist warping of the IC during soldering.

Claims

1. A stiffener for use with an integrated circuit (IC), comprising:

a substantially planar portion; and

a beam portion connected to the planar portion and projecting at a non-zero angle to the plane in which the planar portion lies.

2. A stiffener according to claim 1, wherein the beam portion comprises more than one beam portion.

3. A stiffener according to claim 1, wherein the beam portion comprises a frame portion projecting upward from the planar portion and wherein the stiffener is adapted to be mounted to the IC, and the planar portion rests on top of the IC and the beam portion projects upwardly away from the IC when the stiffener is mounted to the IC.

4. A stiffener according to claim 1, where the beam portion comprises a frame projecting downward from the planar portion and wherein the stiffener is adapted to be mounted to the IC, and the planar portion rests on top of the IC, and the beam projects downwardly away from planar portion and is adjacent at least part of the periphery of the IC when the stiffener is mounted to the IC.

5. A stiffener according to claim 1, wherein the beam portion is integral with the planar portion.

6. A stiffener according to claim 1, wherein the beam portion is a separate component attached to the planar portion.

7. A stiffener according to claim 1, wherein the beam portion projects downwardly around at least a part of the periphery of the IC and further includes an inwardly projecting portion projecting from the beam portion inwardly towards a center of the IC, and under the bottom of the IC when the stiffener is mounted to the IC.

8. A stiffener according to claim 1, wherein the beam portion includes at least one beam element mounted to a top surface of the planar portion, and projecting upward away from the top portion when the stiffener is mounted to the IC.

9. A stiffener for use with an integrated circuit (IC), comprising:

a frame at least partially surrounding peripheral sides of the IC.

10. A stiffener according to claim 9, wherein the frame extends around the entire periphery of the IC.

11. An integrated circuit (IC) package, comprising:

an IC; and

a stiffener attached to the IC, comprising;

a substantially planar portion; and

a beam portion connected to the planar portion and projecting at a non-zero angle to the plane in which the planar portion lies.

12. An IC package according to claim 11, wherein the beam portion comprises more than one beam portion.

13. An IC package according to claim 11, wherein the beam portion comprises a frame portion projecting upward from the planar portion and wherein the stiffener is adapted to be mounted to the IC, and the planar portion rests on top of the IC and the beam portion projects upwardly away from the IC when the stiffener is mounted to the IC.

14. An IC package according to claim 11, where the beam portion comprises a frame projecting downward from the planar portion and wherein the stiffener is adapted to be mounted to the IC, and the planar portion rests on top of the IC, and the beam projects downwardly away from planar portion and is adjacent at least part of the periphery of the IC when the stiffener is mounted to the IC.

15. An IC package according to claim 11, wherein the beam portion is integral with the planar portion.

16. An IC package according to claim 11, wherein the beam portion is a separate component attached to the planar portion.

17. An IC package according to claim 11, wherein the beam portion projects downwardly around at least a part of the periphery of the IC and further includes an inwardly projecting portion projecting from the beam portion inwardly towards a center of the IC, and under the bottom of the IC when the stiffener is mounted to the IC.

18. An IC package according to claim 11, wherein the beam portion includes at least one beam element mounted to a top surface of the planar portion, and projecting upward away from the top portion when the stiffener is mounted to the IC.

19. An integrated circuit (IC) package, comprising:

an IC; and

a stiffener comprising a frame at least partially surrounding peripheral sides of the IC.

20. An IC package according to claim 19, wherein the frame extends around the entire periphery of the IC.