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SEMICONDUCTOR CHIP USED FOR EVALUATION, EVALUATION SYSTEM, AND REPAIRING METHOD THEREOF

  • US 20110237001A1
  • Filed: 02/24/2011
  • Published: 09/29/2011
  • Est. Priority Date: 02/25/2010
  • Status: Abandoned Application
First Claim
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1. An evaluation system for evaluating a semiconductor chip, comprising,the semiconductor chip having on one surface of a semiconductor substrate, at least any of a first wiring film serving as a resistance temperature detector made up of multiple regions, and a second wiring film serving as a heater made up of one or more regions, and an electrode for electrically connecting the first wiring film and the second wiring film,a mount substrate for mounting the semiconductor chip, and a thermally conductive material fixed on the mount substrate, on the other surface of the semiconductor substrate, wherein,the first wiring film is electrically connected to an ammeter and a voltmeter, enabling measurement of temperature of each region, andthe second wiring film is electrically connected to a power source, enabling being heated of each region.

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