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MAIN SPACER TRIM-BACK METHOD FOR REPLACEMENT GATE PROCESS

  • US 20110237040A1
  • Filed: 03/24/2010
  • Published: 09/29/2011
  • Est. Priority Date: 03/24/2010
  • Status: Active Grant
First Claim
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1. A method of trimming back main spacers of replacement gate structures on a substrate, comprising:

  • forming main spacers for replacement gate structures on the substrate, wherein the replacement gate structures have a dielectric layer, a dummy layer over the dielectric layer, and a hard mask over the dummy layer;

    performing source and drain implants, wherein source and drain patterns are formed to allow source and drain implants to be performed on desired regions of the substrate and the source and drain patterns are removed from the substrate after the source and drain implants are performed;

    trimming back the main spacers to increase a space between two adjacent replacement gate structures on the substrate to allow proper formation of metal silicide by subsequent processing;

    after said trimming back, performing source and drain anneal; and

    forming the metal silicide on the substrate.

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