Heat dissipater mounting structure

• US 20110240256A1
• Filed: 04/06/2010
• Published: 10/06/2011
• Est. Priority Date: 04/06/2010
• Status: Abandoned Application

• Current Assignee: Kunshan Jue-Choung Electronics Company Limited (Globe Star Enterprise Limited)
• Original Assignee: Kunshan Jue-Choung Electronics Company Limited (Globe Star Enterprise Limited)
• Inventors: Kuo, Tung-Jung, Huang, Yu-Po
• Application Number:
  US12/662,210
• Publication Number:
  US 20110240256A1
• Time in Patent Office: Days
• US Class Current: 165/67
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A mounting structure is provided for a heat dissipater, including a heat plate having a surface on which a radiator is positioned. A plurality of retention members is set on side margin portions of the surface of the heat plate. The retention members are secured to the heat plate in a locked manner, so that the retention members help spreading stress to realize stable and secure mounting and enhance the performance of heat transfer.

Claims

1. A heat dissipater mounting structure, comprising:

a heat plate;

at least one radiator, which is positioned on a surface of the heat plate; and

a plurality of retention members, which is respectively set on side margin portions of the surface of the heat plate and comprises a plurality of fasteners that secures the retention members to the heat plate.

2. The mounting structure of heat dissipation device as claimed in claim 1, wherein the surface of the heat plate comprises a plurality of side margin portions and wherein two retention members are respectively set on two opposite side margin portions of the surface of the heat plate.

3. The mounting structure of heat dissipation device as claimed in claim 1, wherein the heat plate comprises an extension section on which the radiator is positioned.

4. The mounting structure of heat dissipation device as claimed in claim 1, wherein the heat plate forms a plurality of first mounting holes, the retention members forming a plurality of second mounting holes corresponding to the first mounting holes, the fasteners being respectively received through the first mounting holes and the second mounting holes to secure the retention members to the heat plate.

5. The mounting structure of heat dissipation device as claimed in claim 4, wherein each of the retention members comprises two inclined sections and a flat section, the two inclined sections being respectively connected to two opposite ends of the flat section, the inclined sections forming the second mounting holes, the flat section being positionable on the surface of the heat plate.

6. The mounting structure of heat dissipation device as claimed in claim 1, wherein the fasteners comprise bolts and C clips.

7. The mounting structure of heat dissipation device as claimed in claim 1, wherein the radiator comprises a plurality of stacked heat dissipation fins or heat pipes.

8. The mounting structure of heat dissipation device as claimed in claim 1, wherein the radiator comprises a plurality of stacked heat dissipation fins and heat pipes.

9. The mounting structure of heat dissipation device as claimed in claim 1, wherein a pad is arranged between each of the retention members and the surface of the heat plate.