×

Device and Method for Manufacturing a Device

  • US 20110241197A1
  • Filed: 04/01/2010
  • Published: 10/06/2011
  • Est. Priority Date: 04/01/2010
  • Status: Active Grant
First Claim
Patent Images

1. A device, comprising:

  • a first semiconductor chip;

    a first encapsulant encapsulating the first semiconductor chip and comprising a cavity;

    a carrier; and

    an electrical component mounted on the carrier, wherein the carrier is arranged such that the electrical component is enclosed by the cavity.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×